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《Equipment For Electronic Products Manufacturing》 2003-03
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The Pneumatic Structure Analysis of Step&Scan Stage

LI Ruo-qing(The45th Institute of CETC,Yanjiao065201,China)  
This paper mainly analyzes the pneumatic structure and the principle of the stepscan stage,pointing out some concerned issues in pneumatic designcontrol.
【CateGory Index】: TN305
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【Co-references】
Chinese Journal Full-text Database 10 Hits
1 CHENG Li1, LI Chun-ming2,WANG Zhen-yu1, GAO Ping1(Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);The measures of new technology & development in IC industrial chain[J];Semiconductor Technology;2004-06
2 XIE Chang qing,YE Tian chun (The 3rd Lab of Microelectronics R&D Center,The Chinese Academy of Sciences,Beijing 100010,China);Extreme ultraviolet lithography technology[J];Semiconductor Information;2001-05
3 LI Yan qiu (Micro & Nano Fabrication Devision,Institute of Electrical Engineering,Chinese Academy of Sciences,Beijing 100080,China);The status and tendency of next generation lithography[J];Micronanoelectronic Technology;2003-Z1
4 WANG Fang1, ZHANG Ying-Hui2, ZHAO Mei-ning1 (1. Xi'an Institue of Technology, Xi'an 7100332, China; 2 Kunming University of Technology, Kunming 650093, China);The Modal Analysis of Blanket Cylinder Based on ANSYS[J];Packaging Engineering;2005-04
5 TIAN Jun, PAN Hong-xia, HUANG Jin-ying(Dept. of Mechatronics Engineering, North China Institute of Technology, Taiyuan 030051, China);Experimental Analysis for Dynamic Characteristic of Composite Structures[J];Journal of Test and Measurement Technology;2002-02
6 Cao Jiayong Zhu Yu Wang Jinsong Yin Wensheng Duan Guanghong Zhang Ming (Tsinghua University Beijing 100084 China);Survey of the State of the Art in Planar Motor Technology[J];Transactions of China Electrotechnical Society;2005-04
7 GE Mai-chong (The 45th Institute of Electronics, Ministry of II,Pingliang Gansu 744000, China);The Development of Chip Bonding Techniques and Its Equipment in Microelectronics Packaging Technologies[J];Equipment For Electronic Products Manufacturing;2000-04
8 JIA Song-liang (Institute of microelectronics, Tsinghua University, Beijing 100084, China);Semiconductor Devices Packaging Industry and Equipments for Semiconductor Devices Packaging[J];Equipment For Electronic Products Manufacturing;2003-01
9 HAN Wei-ming(The45th Research Institute of CETC,Beijing East Yanjiao Development Zone101601,China);Design of the Control System for an XYZ Table Used in Wire Bonders[J];Equipment For Electronic Products Manufacturing;2003-03
10 LI Ruo-qing(The45th Institute of CETC,Beijing East Yanjiao065201,China);The usage of Airmount system in lithography[J];Equipment For Electronic Products Manufacturing;2003-05
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