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《Equipment For Electronic Products Manufacturing》 2005-02
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Stamp Fabrication in Nanoimprint Lithography

FAN Dong-sheng, XIE Chang-qing, CHEN Da-peng(Key Laboratory of Nano-Fabrication and Novel Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China)  
The cost of Optical lithography in Next Generation Lithography becomes higher and higher, which make the industry look for new methods for integrated circuits production. Nanoimprint, as a non-optical lithography technology , has demonstrated its ability for semiconductor manufacturing by offering resolution below sub-10nm feature size, high throughput and low cost. And also, nanoimprint can be used in MEMS and other applications to reproduce nanostructure. There are a few varieties in nanoimprint, which can be loosely divided into hot embossing, UV-cured imprinting, and micro-contact printing. In this paper, the stamp fabrication process and anti-adhesive layer for these three different techniques are discussed in detail respectively, and different application fields of these three different techniques are presented.
【Fund】: 973(G200036504);; 国家自然科学基金资助项目(60236010)
【CateGory Index】: TN305.7
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