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《Equipment For Electronic Products Manufacturing》 2005-11
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The Next Generation Lithography

TONG Jun-min1,2,HU Song1,YU Guo-bing1 (1. Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 61 0209, China; 2. Graduate School of the Chinese Academy of Sciences, Beijing100039,China)  
The evolution of the Next Generation Lithography(NGL) is introduced. T he principles,advantages,disadvantages and RD of Extreme Ultraviolet Lithograph y(EUVL),Immersion Lithography,Nanoimprint Lithography and Maskless Lithography(M L2)are stressed,and the prospects of them are described.
【CateGory Index】: TN305.7
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Chinese Journal Full-text Database 2 Hits
1 YAN Wei1,HU Song1,TANG Xiao-ping1,ZHAO Li-xin1,YANG Yong1,2 JIANG Wen-bo1,2,ZHOU Shao-lin1,2,CHEN Wang-fu1,2 (1.Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China; 2.Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China);The method and equipment of maskless step digital lithography based on DMD[J];Equipment for Electronic Products Manufacturing;2008-10
2 HUO Yong-en, JIA Yue, WANG Li-yuan (College of Chemistry ,Beijing Normal University, Beijing 100875,P.R China);Progress of the Study on Nanoimprint Resists[J];Imaging Science and Photochemistry;2008-02
Chinese Journal Full-text Database 3 Hits
1 Soichi Owa and Hiroyuki Nagasaka(Nikon Corporation,201-9Miizugahara,Kumagaya,Saitama,Japan360-8559);Advantage and Feasibility of Immersion Lithography[J];Equipment For Electronic Products Manufacturing;2004-02
2 Zhang Honghai Hu Xiaofeng Fan Xiqiu Liu Sheng Zhang Honghai Prof.; College of Mech. & Eng., Huazhong Univ. of Sci. & Tech., Wuhan 430074, China.;Nanoimprint lithography technology[J];Journal of Huazhong University of Science and Technology;2004-12
3 LI Yanqiu(The Institute of Electrical Engineering of Chinese Academy of Science,Beijing 100080,China);Lithography Tool Evolution and the Trend of Its Development[J];Microfabrication Technology;2003-02
Chinese Journal Full-text Database 10 Hits
1 WANG Zhen-yua, CHENG Lib, ZHU Junb, LI Lanb(a.Institute of Applied Science and Technology;b.Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Technologies and Applications of Electron Beam Exposure[J];Semiconductor Technology;2006-06
2 Chu Jinkui1,2,Guo Qing1,2,Meng Fantao1,2,Han Zhitao1,2(1.Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116023,China;2.Key Laboratory for Micro/Nano Technology and System of Liao Ning Province,Dalian 116023,China);Simulation Analysis of the Filling Process of Polymer in Hot Embossing[J];Semiconductor Technology;2008-11
3 FAN Dong-sheng, XIE Chang-qing, CHEN Da-peng(Key Laboratory of Nano-Fabrication and Novel Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China);Stamp Fabrication in Nanoimprint Lithography[J];Equipment For Electronic Products Manufacturing;2005-02
4 YANG Qing-hua ,LIU Ming , CHEN Da-peng , YE Tian-chun(Lab of Nanofabrication and Novel Devices Integration, Institute of Microelectronics of Chinese Academy of Sciences, Beijing);Gauss Electron Beam Lithography System[J];Equipment For Electronic Products Manufacturing;2005-02
5 DENG Xi-shu, WU Yun-xin, LI Jian-ping (College of Mechanical and Electrical Engineering ,Central South University ,Hunan Changsha 410083;);Structure Design and Simulation Study of Precision Vibration-reduction Control System for Experimental Work Table ofthe Stepping-Scanning Lithography[J];Equipment For Electronic Products Manufacturing;2005-10
6 DENG Xi-shu, WU Yun-xin, YANG Fu-qiang, WANG Yong-hua (College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China);Design and Manufacture on Precision Positioning System of Wafer Stage for a Simulated Macro-motion System of Lithography[J];Equipment for Electronic Products Manufacturing;2007-02
7 Ma Xiang-guo1,Liu Tong-juan1,Gu Wen-qi2(1.Beijing Wuzi University,Beijing 101149,China;2.Institute of Electrical Engineering,Chinese Academy of Sciences,Beijing 100080,China);The Three Beam Technology in IC Manufacturers[J];Equipment for Electronic Products Manufacturing;2008-04
8 Shi Wentian Wang Xibin Xin Ming et al,Doctor Candidate,School of Mechanical and Vehicle Engineering,Beijing Institute of Technology,Beijing 100081,China;Study on Micro-turning Surface Roughness of Aluminum Alloy LY12 without Cutting Fluid[J];Tool Engineering;2009-01
9 Zhou Yuan1,3 Li Yanqiu21Institute of Electrical Engineering,the Chinese Academy of Sciences,Beijing 100080,China2Beijing Institute of Technology,Beijing 100081,China3Graduate University of Chinese Academy of Sciences,Beijing 100039,China;Optimization of Topside Antireflective Coatings for Hyper Numerical Aperture Lithography[J];Acta Optica Sinica;2008-02
10 Wang Dingli1,3,4,Zhou Ning3,4,Wang Lei2,Liu Wen2,4,Xu Zhimou2,Shi Jing1(1.Key Laboratory of Acoustic and Photonic Materials and Devices of Ministry of Education,Department of Physics,Wuhan University,Wuhan 430072,China;2.Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technologies,Wuhan 430074,China;3.Accelink Technologies Co.,LTD.,Wuhan 430074,China;4.State Key Laboratory for New Optical Communication Technologies and Networks,Wuhan 430074,China);DFB Gratings for Semiconductor Laser Diodes by Nanoimprint Lithography[J];Micronanoelectronic Technology;2010-01
China Proceedings of conference Full-text Database 2 Hits
1 XU Jian, WANG Gong-ping, DONG Jian-feng, XU Qing-bo (College of Information Sciences and Engineering, Ningbo University, Ningbo 315211, China);Sol-gel Arrayed Micro-structures Prepared by Imprinted Lithography[A];[C];2007
2 FAN Xi-qiu, ZHANG Hong-hai, WANG Xue-fang, JIA Ke, LIU Sheng (Institute of Micro-Systems, Huazhong University of Science & Technology, Wuhan 430074, China);Nanometer imprint lithography techniques——the next generation lithography[A];[C];2005
Chinese Journal Full-text Database 10 Hits
1 SI Wei-hua~(1,2),DONG Xiao-wen~(1,2),GU Wen-qi~1(1.Institute of Electrical Engineering,Chinese Academy of Sciences,Beijing 100080,CHN;2.Graduate School of Chinese Academy of Sciences,Beijing 100039,CHN);Process and Pattern Precision in Nano-imprinting Lithography[J];Semiconductor Optoelectronics;2006-04
2 LUO Bo-liang, DU Jing-lei, TANG Xiong-gui,DU Chun-lei,LIU Shi-jie,GUO Yong-kang (Physics Dept of Sichuan University, Chengdu 610064,China; State Key Lab of Optical Technology on Microfabrication, Chinese Academy of Sciences, Chengdu 610209,China; Physics Dept of Shanxi University of Technology, Hanzhong 723001 .China);Technical Study of AZ4620 Thick Photoresist for Micro Fabrication[J];Semiconductor Technology;2005-07
3 CHENG Li, WANG Zhen-yu, ZHU Yi-yun, LIU He-xiang(Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Extremely Ultraviolet Lithography Fabrication Technology for Nanometer ULSI Devices[J];Semiconductor Technology;2005-09
4 LIU Shi-jie1,2,DU Jing-lei1,XIAO Xiao1,TANG Xiong-gui1,PENG Qin-jun1,LIU Jian-li1,GUO Yong-kang1(1.Department of Physics,Sichuan University,Chengdu 610064,China;2.Department of Physics,Shanxi University of Technology,Hanzhong 723001,China);Analysis of standing wave effect in photolithography[J];Micronanoelectronic Technology;2004-02
5 Liu Shijie 1,2 ,Du Jinglei1,Duan Xi1,Luo Boliang1,Tang Xionggui1, Guo Yongkang1,and Du Chunlei3(1 Physics Department of Sichuan University,Chengdu 610064,China) (2 Physics Department of Shanxi University of Technology,Hanzhong 723001,China) (3 State Key Laboratory of Optical Technology on Microfabrication,Chinese Academy of Sciences,Chengdu 610209,China);Enhanced Exposure Model and Its Parameter Measurements for Thick Photoresist[J];Chinese Journal of Semiconductors;2005-05
6 LI Cai-hua, WANG Xin, WANG Xue-ying (Shenzhen Graduate Sch,Harbin Institute of Technology,Shenzhen 518055,China);Application of edge detection technology in center recognition of workpiece[J];Journal of Transducer Technology;2005-04
7 LI Hong1,2, ZHOU Yunfei1 (1.National Engineering Research Center of NC System Technology,Huazhong University of Science & Technology,Wuhan 430074,China; 2.Dept. of Electric Power Engineering,Changsha University of Electric Power,Changsha 410077,China);Application of Predictive Feedforward Compensation Control to Long Stroke Motor in Scanning Wafer Stage of Lithography[J];Journal of Changsha University of Electric Power(Natural Science);2003-03
8 TONG Zhi-yi, GE Mai-chong (The 45th Institute of Electronics,Ministry of II,Pingliang 744000,China);Extending Optical Lithography to 50 nm Node[J];Equipment For Electronic Products Manufacturing;2001-03
9 YANG Xing-ping (The 45th Institute of CETC, Beijing East Yanjiao 101601, China);The OF Detection and the OF Prealignment Technology Of Wafer Loader System[J];Equipment For Electronic Products Manufacturing;2003-01
10 WANG Xue-jun ZhANG Zhi-jun(The45th Electronic Institute of CETC,Beijing East Yanjiao suburb101601,China);A New Wafer Automatic Positioning Method[J];Equipment For Electronic Products Manufacturing;2003-02
【Secondary References】
Chinese Journal Full-text Database 2 Hits
1 LU Jin-hong,XIE Xiang-sheng,ZHANG Pei-qing,ZHOU Jian-ying(State Key Laboratory of Optoelectronic Materials and Technologies,Sun Yat-sen University,Guangzhou 510275,China);Submicron-sized Optical Fabrication with DMD Based Lithography[J];Acta Photonica Sinica;2010-04
2 LI Ping-gui GONG Yong-qing HE Xing-dao LIU Zhi-huai ZHANG Gui-hong (College of Automation,Nanchang Hangkong University,Nanchang,Jiangxi 330063,China);Research on the Method of Micro-optical Elements Mask Fabricated by Lithography Technology[J];Science and Technology of West China;2008-06
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