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The Researches of Cooling Rate in Lead-free Reflow Soldering

XU Bo, WANG Le, SHI Jian-Wei, YUAN He-Ping, QIAN YiYu (Harbin Institute of Technology, Harbin, 150001, China Sun East Electronic Technology (Shenzhen) Company Lt.d, Shenzhen, 518103 China)  
This article introduces the researches of the effect of cooling rate on lead-free reflow soldering quality, and summarizes how the cooling rate effects the solder and the reliability of solder joints in SMT. It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.
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