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《Equipment for Electronic Products Manufacturing》 2006-10
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Application of Linear Motor:Picking and Placement Mechanism in High-speed Die Bonder

GUO Qiang-sheng(The 45th Institute of CECT, Beijing East Yanjiao 101601, China)  
The author illustrates the working principle of chip Picking and Placement Mechanism (PPM)-the core module in high-speed Die Bonder, and the characteristics of American SMAC linear motor. By the application of the linear motor on chip PPM, the technology, chip's high speed, high precision and soft picking and placement control, is achieved.
【CateGory Index】: TM359.9;TN405
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