EXPERIMENTAL RESEARCH ON THE THERMAL CONTACT RESISTANCE BETWEEN Cu-Cu IN VACUUM AND LOW TEMPERATURE
Zhang Tao; Xu Lie; Xiong Wei; Zhao Lanping(Department of refrigeration and cryogenics, Shanghai Jiaotong University, Shanghai 200030)
In this paper The phenomena of thermal Contact Resistance (TCR) at the interface between solid was analyzed simply and an experimental used to measure the TCR betweenthe cylinder or thin disk samples was set up with high accuracy. In vacuum and low temperature,the TCR between Cu and Cu has been measured. The experimental data indicated that the TCRdepends on the applied pressure and the interface temperature. The logarithm of the measuredTCR was proportional to the logarithm of the applied pressure. At last, using the modified G-Wmodel, the experimental results was analyzed and compared with predicated results. This ascertains that the experimental results are correct.
【CateGory Index】： O513