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《GRYOGENICS》 1999-04
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Xu Lie Zhang Tao Zhao Lanping Li Zhaoci Hu Yonggang (Shanghai Jiao Tong University,Shanghai 200030)  
In this paper the mechanism of the thermal contact resistance of solid materials at low temperature and vacuum was introduced in brief.The experimental apparatus using double heat flux meter method to measure the thermal contact resistance between the rod shape or thin disk shape samples was also introduced mainly.At the same time,the apparatus can be used to measure the thermal conductivity of materials.Finally,the thermal contact resistance of some materials at low temperature and vacuum was proposed.
【CateGory Index】: TB611
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Chinese Journal Full-text Database 6 Hits
1 ZHANG Li-wen,ZHU De-cai,XING Lei,ZHANG Guo-liang,WEI Rong-xuan School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,China;Experimental measurement on thermal contact conductance coefficient between aluminum alloys and 5CrMnMo die steel[J];Journal of Dalian University of Technology;2009-01
2 XU RUI PING XU LIE Institute of Refrigeration and Cryogenics Engineering, Shanghai Jiaotong University, Shanghai 200030;STUDY OF THE GAS GAP CONDUCTANCE BETWEEN ROUGH CONTACT SURFACES AT LOW TEMPERATURE[J];Chinese Journal of Low Temperature Physics;2005-01
3 Zhao Lanping, Xu Lie, Li Zhaoci, Sun Heng (Department of Refrigeration and Cryogenics, Shanghai Jiaotong University, 200030);Research on the Relationship between Thermal Contact Conductance of Solid Interfaces and Cycling Load at Low Temperatures[J];CRYOGENICS AND SUPER CONDUCTIVITY;2000-01
4 ZHU De-cai1,2,ZHANG Li-wen1,2,PEI Ji-bin1,2,ZHANG Guo-liang2,WEI Rong-xuan2(1.The State Key Laboratory for Materials Modification by Laser,Ion and Electron Beams,Dalian University of Technology,Dalian 116024,China;2.School of Materials Science and Engineering, Dalian University of Technology,Dalian 116024,China);Experimental research of influence factors on solid interface thermal contact conductance coefficient[J];Forging & Stamping Technology;2008-01
5 ZHANG Xing-zhi,ZHANG Li-wen,XING Lei(State Key Laboratory of Materials Modification by Electron,Ion and Laser Beam,Dalian University of Technology,Dalian 116024,China);Effect of Glass Lubrication on Thermal Contact Resistance between TA15 Titanium Alloy and K403 Ni Base Alloy[J];Materials for Mechanical Engineering;2009-07
6 ZHU De-cai ZHANG Li-wen PEI Ji-bin ZHANG Guo-liang WEI Rong-xuan(Dalian University of Technology,Dalian 116024 China);Experiment research on the thermal contact conductance during the solid plastic forming[J];Journal of Plasticity Engineering;2008-01
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2 YIN Xiaojing;A.Degiovanni(Department of Energy Engineering,USTB,Beijing 100083,PRC)(LAMTA-INPL-France);Study of Contact Thermal Resistance Between Two Coaxial Cylindrical Layers(Ⅰ):Mathematical Model[J];JOURNAL OF UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING;1996-04
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【Secondary References】
Chinese Journal Full-text Database 5 Hits
1 Zhao Lanping (Department of Thermal Engineering, Tongji University, Shanghai, 200093) Xu Lie (Department of Refrigeration and Cryogenics, Shanghai Jiaotong University, 200030);Study on "Hysteresis" Phenomenon of Heat Transfer Between Solid Interfacesat Cryogenic Temperatures[J];Cryogenics and Superconductivity;2002-03
2 LIN Jian-ping1,SUN Guo-hua1,ZHU Qiao-hong1,HU Qi1,WANG Li-ying1,TIAN Hao-bin2(1.College of Mechanical Engineering,Tongji University,Shanghai 201804,China;2.School of Mechanical and Electronic Engineering,Shanghai Second Polytechnic University,Shanghai 201209,China);Research on analytical model of blank temperature prediction for hot stamping of ultra high strength steels[J];Forging & Stamping Technology;2009-01
3 GONG Zhao YANG Chun-Xin (505 Faculty,School of Aeronautic Science and Technology,Beihang University,Beijing 100083,China);THE SIMPLIFICATION OF THE THERMAL CONTACT CONDUCTANCE MODEL[J];Journal of Engineering Thermophysics;2007-05
4 WAN Xiao-peng1 CHEN Zhan-hui1,2 ZHAO Mei-ying1 HOU Chi1(1 School of Aeronautics,Northwestern Polytechnical University,Xi’an 710072,China)(2 College of Missile,Air Force Engineering University,Sanyuan Shaanxi 713800,China);Analysis of diathermancy about unglued structure of thermal protection systems of reusable launch vehicles[J];Structure & Environment Engineering;2009-02
5 CHEN Jin~1, CUI Jing-jing~1,WANG Hui-ling~2, XU Jian-feng~1,WANG Jian~2(1.School of Automation, Wuhan University of Technology,Wuhan 430070,China;2.Institute of Refrigeration and Cryogenics, Huazhong University of Science and Technology, Wuhan 430074,China);Visual Simulation of Three Dimension Interfacial Thermal Resistance Between Solids at Low Temperature[J];Journal of Wuhan University of Technology;2005-09
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