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《GRYOGENICS》 1999-04
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USING DOUBLE HEAT FLUX METER METHOD TO MEASURE THE THERMAL CONTACT RESISTANCE OF SOLID MATERIAL AT LOW TEMPERATURE AND VACUUM

Xu Lie Zhang Tao Zhao Lanping Li Zhaoci Hu Yonggang (Shanghai Jiao Tong University,Shanghai 200030)  
In this paper the mechanism of the thermal contact resistance of solid materials at low temperature and vacuum was introduced in brief.The experimental apparatus using double heat flux meter method to measure the thermal contact resistance between the rod shape or thin disk shape samples was also introduced mainly.At the same time,the apparatus can be used to measure the thermal conductivity of materials.Finally,the thermal contact resistance of some materials at low temperature and vacuum was proposed.
【CateGory Index】: TB611
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【References】
Chinese Journal Full-text Database 6 Hits
1 ZHANG Li-wen,ZHU De-cai,XING Lei,ZHANG Guo-liang,WEI Rong-xuan School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,China;Experimental measurement on thermal contact conductance coefficient between aluminum alloys and 5CrMnMo die steel[J];Journal of Dalian University of Technology;2009-01
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