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《Electronics & Packaging》 2004-01
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The Advanced Microelectronics Packaging Technology

GAO Shang-tong YANG Ke-wu (China Electronics Technology Group Corporation No.13 Research Institute, Shijiazhuang Hebei 050051, China)  
This paper describes the advanced microelectronics packaging technology which has developed rapidly during the 1990.The technology includes BGA, CSP, WLP, 3D packaging , SIP etc.And it introduces the concept on three level packaging.In addition it gives some considerations and suggestions for developing the advanced microelectronics packaging technology in china.
【CateGory Index】: TN405
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