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《Electronics & Packaging》 2008-02
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Packaging Technical Challenges of High-power White LED

TIAN Da-lei,WANG Xing,GUAN Rong-feng(Institute of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454003,China)  
Packaging technique is the key for LED entering the general illumination. Latest research productions about LED chips and packaging functions are introduced,technical keys of packaging are discussed,including eutectic bonding,flip-chip bonding and cooling technology,the future trends and challenges of LED packaging technology are presented in the end.
【Fund】: 河南省重点科技攻关资助项目(072102240027);; 河南理工大学博士基金资助项目(648602);; 河南理工大学研究生学位论文创新基金资助项目(644005)
【CateGory Index】: TN305.94;TN312.8
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