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《Forging & Stamping Technology》 2007-04
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Study on micro deep drawing process and die design

XI Qing-biao,DONG Xiang-huai(National Die and Mold CAD Engineering Research Center,Shanghai Jiaotong University,Shanghai 200030,China)  
Micro deep drawing characteristics and die design of thin copper foils with the thickness of 0.2 mm were studied by experimental investigations and Finite Element Analysis.Micro deep drawing of three different cup sizes for punch force curves was done.Numerical simulations were used to study the influence of friction coefficient μ and deviations of process-determining geometric factors,e.g.,the relative tool clearance C/t and relative die radius Rd/t,on the micro deep drawing process for producing cups of 5 mm in diameter and 0.1 mm in thickness.The results show that friction coefficient μ can have a decisive influence on maximum punch force and the deviations of die geometry within the given manufacturing tolerances have an inconspicuous influence on maximum punch force.If taking size effect on friction into account,the dimensionless design method for micro deep drawing process and die is valid.
【Fund】: 国家自然科学基金资助项目(50275059)
【CateGory Index】: TG386.32
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