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《Forging & Stamping Technology》 2010-02
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Research on spring-back simulation and die surface optimization of automotive panel forming process

DUAN Lei,CAI Yu-jun,MO Guo-qiang,CHENG Shou-yi(Tianjin Key Laboratory of High Speed Cutting and Precision Machining,Tianjin University of Technology and Education,Tianjin 300222,China)  
The spring-back phenomenon in automotive panel forming is one of the main quality problems,which may affect the tolerance and final shape of panel products.The stamping and spring-back process simulation for the automotive panel were realized by using the Dynaform software,emphasizing on the possibly spring-back quantity forecasted and the die surface was optimized to control spring-back.The reasonability of optimization scheme and veracity of simulation were proved by comparing the simulation result with the eligible part obtained.And it provides a significant guidance to the manufacture of the automotive panel dies.
【Fund】: 天津高校双五科技计划资助项目(SWPY20080003);; 天津工程师范学院科研发展基金资助项目(KYQD08017 KJ09-001)
【CateGory Index】: TG386;U463
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