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《Plating & Finishing》 2008-08
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Comparison between the Electroless Copper Plating Processes Using Sodiu m Hypophosphite and For maldehyde as Reductants

YANG Fang-Zu,YANG Bin,HUANG Ling,XU Shu-kai,YAO Guang-hua,ZHOU Shao-min(State Key Laboratory of Physical Chemistry of the Solid Surfaces,Department of Chemistry,Colleg of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005,China)  
The processes of the electroless copper plating using sodium hypophosphite and formaldehyde as reductants were compared and evaluated.The results show that the electrolyte using sodium hypophosphite as reducing agent is more stable than that using formaldehyde as reducing agent;the electroless deposition rate of the sodium hypophosphite solution is higher than that of the formaldehyde bath;the deposit grains are very fine and dense when using formaldehyde as reductant,and the other is of agglomerate morphology;the copper content in formaldehyde's deposit is nearly 100%(wt),and the deposit from sodium hypophosphite bath contains 93.9%(wt) copper and 6.1%(wt) nickel;the conductirity,tensile strength and ductibility of formaldehyde's deposit are better than that from the sodium hypophosphite solution.
【Fund】: 国家科技攻关计划资助项目(2004BA325C)
【CateGory Index】: TQ153.14
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