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《Electronic Components $ Materials》 2003-06
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Improvement of Adhesion between Metallic Films and Substrates

TENG Lin, YANG Bang-chao, CUI Hong-ling, DU Xiao-song (College of Microelectronics and Solid State Electronics, University of Electronic Science and Technology, Chengdu 610054, China)  
Based on the mechanism of film adhesion, the factors influencing the adhesion between films and substrates are briefly reviewed. The binding strength of the films can be improved by decreasing the stress between the film and the substrate with an interlayer inserted in between. The performance of the metallic film can also be improved in this way. By proper heat treatment, inner stress can be eliminated, interface reaction can be enhanced and the metallic film performances can be influenced.
【Fund】: 军事电子预研基金资助项目(AW030412)
【CateGory Index】: TN304.055
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