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《Electronic Components $ Materials》 2005-04
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Creep Behavior of Lead-free Electronic Solder Alloys

LIAO Fu-ping,ZHOU Lang ,HUANG Hui-zhen,YAN Ming-ming(School of Sciece and Engineering,Nanchang University,Nanchang 330047,China)  
A simple and reliable end-creep tester wa maded Room temperature creep tests of lead-free solder alloys Sn-9Zn and n-3.5Ag-0.7Cu,along with the conventional solder alloy Sn-40Pb a a reference,were carried out with the self-made tester.Effect f cooling rate on the creep behavior wa also investigated.The reults show that lead-free solder alloys have higher creep strength than the conventional Sn-40Pb solder alloy.Compared with Sn-9Zn,Sn-3.5Ag-0.7Cu has higher creep strength.For both of the alloys,higher cooling rate reults in finer microstructures.However,the effects of cooling rate on creep strength are different for Sn-9Zn and Sn-3.5Ag-0.7Cu,with the water-cooled Sn-9Zn weader than the air-cooled,while the water-cooled Sn-3.5Ag-0.7Cu stronger than its air-cooled state.the posible reason for thi difference was discussed.
【CateGory Index】: TN604
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