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《Electronic Components $ Materials》 2005-05
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Development of Fluxes for Sn-9Zn Lead-free Electronic Solder

JIN Quan-jun, ZHOU Lang, SUN Wei, YAN Ming-ming, DING Yan (School of Materials Science and Engineering, Nanchang University, Nanchang 330047, China)  
Sn-9Zn eutectic alloy wettability is poor when used with conventional rosin flux. A new fluxes for Sn-9Zn by modifying rosin based fluxes were developed. Spreading ratio measurement and wet balance was used to characterize the wettability under various fluxes. Weight loss measurement was adopted to examine the corrosiveness of the fluxes. The results show that the wettability Sn-9Zn to copper can be greatly improved by minor addition of SnCl2 to ethanal-rosin as a flux. However, the SnCl2-containing flux is found corrosive to the solder alloys. A inhibitor with high activity was chosen. Addition of this inhibitor to the SnCl2-containing flux can diminish its most corrosiveness, while further enhancing the wettability of Sn-9Zn alloy to copper.
【CateGory Index】: TG425
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