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《Electronic Components and Materials》 2008-06
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Sputtering simulation of NdFeB permanent magnet target

LUO Zhe-ting,ZHANG Min-gang,WU Jing,LUO Chun-yun(School of Materials Science and Engineering,Taiyuan University of Science and Technology,Taiyuan 030024,China)  
The sputtering process for targets of Nd2Fe14B was simulated using SRIM2006 software.Incidence energy and angle of the incidence ion were analyzed.The general rules for sputtering yield,incidence ion energy、angle and sputtering target materials were obtained as the follows: 1) the sputtering yield increases with rise of incidence ion energy,it is increased rapidly in low energy region and is gradually increased in high energy region;2) the sputtering yield gradually increases with increase of incidence angle of incidence ion and its greatest value is at 70°~80°,when incidence angle of incidence ion is 75°,incidentce ion energy is 7 keV,the sputtering yield reaches 4.398(atom.ion–1);3) the thin film composition is different to target due to the deviation of mole ratio between sputtering atom and target atom.
【Fund】: 山西省自然科学基金资助项目(No.20021067)
【CateGory Index】: TM273
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