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《Electronic Components and Materials》 2010-09
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Effect of nonionic surfactants on wettability of the soldering flux

XU Dongxia1,WANG Dongbin1,HAN Fei2,LEI Yongping3(1.College of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454000,Henan Province,China;2.China North Optical-electrical Technology Co.,Ltd,Beijing 100176,China;3.College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China)  
Three kinds of nonionic surfactants(Triton X—100,Tween—20 and PEG2000) were added into the no-clean soldering fluxes,thus three groups of fluxes were gained.Experiments of solder spreadability were carried out on the pure copper plates with three groups of fluxes and Sn0.7Cu lead-free solder.The results show that when the mass fraction of nonionic surfactants Triton X—100 and Tween—20 both are 0.6%,the minimum wetting angles are 30.07° and 29.70°,respectively,and the maximum spread areas are 56.67 mm2 and 58.53 mm2,respectively.When the mass fraction of PEG2000 is 0.3%,the minimum wetting angle is 26.70° and the maximum spread area is 66.88 mm2 which is increased by 26.9% compared with that of the soldering flux with no PEG2000 addition.It is obvious that appropriate addition of nonionic surfactants can improve the wettability of soldering flux and enhance the spreadability of the lead-free solder.
【Fund】: 河南理工大学博士基金资助项目;河南理工大学金属材料及加工工程学科发展基金资助项目
【CateGory Index】: TG454
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