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《Electronic Components and Materials》 2011-06
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Research development of nano-composite lead-free solders

MA Yunzhu,LI Yongjun,LIU Wensheng(State Key Laboratory for Powder Metallurgy,Central South University,Changsha 410083,China)  
The application of lead-free solder mostly depends on its melting temperature,wetting property and reliability in the course of long-term service.The properties of lead-free solder are enhanced effectively by trace amount of nano-particles addition.In particular,the creep rupture life of SnCu solder adding nano-Ag particle is thirteen times that of non-added SnCu solder.The effects of nano-particles on physical and chemical properties of lead-free solder are introduced.The microstructure and mechanical properties of nano-composite lead-free solder are discussed.The application prospect of nano-sized particles addition on lead-free solders is forecasted.
【Fund】: 国家配套资助项目(No.JPPT—115—2—1057)
【CateGory Index】: TB383.1;TG42
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