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《ELECTRONIC COMPONENTS $ MATERIALS》 1995-01
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Modeling of Heat Transfer in the Surface Mounting of Electronic Components During Reflow Process

Du Lei; Sun Chengyong; Bao Junling  
Transient heat transfer during conrection reflow process in typical structure of surface mount devices (SMD) is modelled with the help of finite element numerical analysis. The temperature distribution in reflow stages is discribed by direct and clear isothermal gpaph , through which the heat transfer in SMD can be understood quantitalively. This method can be used for optimization of SMT reflow technology ( temperature curves) and CAD of the temperature curves and promotes enhancement of rate of qualified SMDs and their reliability.
【CateGory Index】: TN420.5
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【References】
Chinese Journal Full-text Database 4 Hits
1 Qi Lin;Du Shuang;Li Jiabin;Lu Ming;Beijing Institute of Space Mechanics and Electricity;;Research on Technology Preventing Warpage Deformation of Large Area PCBAs[J];航天制造技术;2015-06
2 LI Na,YU Xin-hong(School of Materials of Northwestern Polytechnical University,Xian 710072,China);Simulation for Lead-free Solder in Ten-zone Reflow Soldering of PCB Assembly[J];电子工艺技术;2012-01
3 MAO Xin-long, HAN Guo-ming, HUANG Bing-yuan, et al.(College of Material Science and Engineering, Tianjin University, Tianjin 300072, China);Modeling and simulating of reflow soldering in SMT[J];焊接技术;2004-06
4 HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China);Research Status of Reflow Soldering Process in SMT[J];电子工艺技术;2004-06
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 YANG Guang-yu,XU Xin,DONG Yi(The Institute of Electronic Engineering of CAEP,Mianyang 621900,China);Contrast Performance Analysis Between Lead-free and Tin-lead Alloys[J];电子工艺技术;2008-06
2 WANG Wen-li,YAN Yan-fu,Wu Bo(1.Shenzhen Institute of Information Technology,Shenzhen 518029,China;2.Henan University of Science and Technology,Luoyang 471003,China);Lead-free Soldering High Temperature Influences on Components Reliable Application[J];电子工艺技术;2008-06
3 MAO Xin-long, HAN Guo-ming, HUANG Bing-yuan, et al.(College of Material Science and Engineering, Tianjin University, Tianjin 300072, China);Modeling and simulating of reflow soldering in SMT[J];焊接技术;2004-06
4 HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China);Research Status of Reflow Soldering Process in SMT[J];电子工艺技术;2004-06
5 Harbin Institute of Technology Tian Yanhong, Wang Chunqing;RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY[J];焊接;2002-06
6 DING Ying,WANG Chun-qing (AWRT of Harbin Institute of Technology,Harbin 510610,China);The Theory and Experiment Researches about The Solder Joint Reliability on PCB[J];电子工艺技术;2001-06
7 PAN Kai-lin,ZHOU De-jian,QIN Kuang-yu (Guilin Institute of Electronic Technology,Guilin 541004,China);Study on Simulation of Reflow Soldering Process of SMT[J];电子工艺技术;2000-05
8 HUANG Chun-yue,ZHOU De-jian (Guilin Institute of Electronic Technology,Guilin 541004,China);Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology[J];电子工艺技术;2000-04
9 YU Chun,ZHOU Xiong hui,ZHANG Yong qing;FEA Oriented Feature based Modeling Technology[J];工程设计;1999-03
10 HAO Ying-zheng WANG Cai-yun (Second Research Institute of Ministry of Electronics Industry,Taiyuan030024,China);General Technology Requirements for Reflow Solderingand Test Way of Temperature Profile[J];电子工艺技术;1999-04
【Secondary References】
Chinese Journal Full-text Database 8 Hits
1 Gao Weina;Hu Fengda;He Zongpeng;Ma Xinna;Beijing Spacecrafts Co., Ltd.;;Discussion on Failure Problem of Glass Sealed Surface Mount Diodes[J];航天制造技术;2018-02
2 SUN Qi;CHEN You-zhen;YU Shu-bao;CAO Hong-sheng;Beijing Railway Signal Co.Ltd.;;Refl ow Profi le of Large Heat Capacity PCB With Small Devices[J];电子工艺技术;2016-04
3 GONG Yubing(School of Mechanical & Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China);Study on Optimization of Furnace Temperature Profile Under Reflow Soldering[J];热加工工艺;2013-15
4 LING Yue-hong(China National Aeronautical Radio Electronics Research Institute,Shanghai 200241,China);Optimizing of Mixed PCB Technology of Reflow Soldering for Aeronautical Product[J];航空电子技术;2013-01
5 HUANG Chun-guang(HUAWEI TECHNOLOGIES CO.,Ltd.Shenzhen 518129,China);Study on Defects Prventation of Vertical Surface-Mount Module during Reflow Process[J];电子工艺技术;2012-04
6 SUO Xiao-lin,YU Xin-hong(Northwestern Polytechnical University,Xi’an 710072,China);Effect of Electronic Components Placements on Temperatures Field for PCB during Reflow Soldering[J];电子工艺技术;2012-03
7 LI Na,YU Xin-hong(School of Materials of Northwestern Polytechnical University,Xian 710072,China);Simulation for Lead-free Solder in Ten-zone Reflow Soldering of PCB Assembly[J];电子工艺技术;2012-01
8 SONG Yao-zong,SHI Jian-wei,RAO Shu-min(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China);Research of Hot Air Reflow Oven’s Temperature Controlled System[J];电子工艺技术;2011-03
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