Modeling of Heat Transfer in the Surface Mounting of Electronic Components During Reflow Process
Du Lei; Sun Chengyong; Bao Junling
Transient heat transfer during conrection reflow process in typical structure of surface mount devices (SMD) is modelled with the help of finite element numerical analysis. The temperature distribution in reflow stages is discribed by direct and clear isothermal gpaph , through which the heat transfer in SMD can be understood quantitalively. This method can be used for optimization of SMT reflow technology ( temperature curves) and CAD of the temperature curves and promotes enhancement of rate of qualified SMDs and their reliability.