|
| 1 |
YANG Guang-yu,XU Xin,DONG Yi(The Institute of Electronic Engineering of CAEP,Mianyang 621900,China);Contrast Performance Analysis Between Lead-free and Tin-lead Alloys[J];电子工艺技术;2008-06 |
| 2 |
WANG Wen-li,YAN Yan-fu,Wu Bo(1.Shenzhen Institute of Information Technology,Shenzhen 518029,China;2.Henan University of Science and Technology,Luoyang 471003,China);Lead-free Soldering High Temperature Influences on Components Reliable Application[J];电子工艺技术;2008-06 |
| 3 |
MAO Xin-long, HAN Guo-ming, HUANG Bing-yuan, et al.(College of Material Science and Engineering, Tianjin University, Tianjin 300072, China);Modeling and simulating of reflow soldering in SMT[J];焊接技术;2004-06 |
| 4 |
HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China);Research Status of Reflow Soldering Process in SMT[J];电子工艺技术;2004-06 |
| 5 |
Harbin Institute of Technology Tian Yanhong, Wang Chunqing;RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY[J];焊接;2002-06 |
| 6 |
DING Ying,WANG Chun-qing (AWRT of Harbin Institute of Technology,Harbin 510610,China);The Theory and Experiment Researches about The Solder Joint Reliability on PCB[J];电子工艺技术;2001-06 |
| 7 |
PAN Kai-lin,ZHOU De-jian,QIN Kuang-yu (Guilin Institute of Electronic Technology,Guilin 541004,China);Study on Simulation of Reflow Soldering Process of SMT[J];电子工艺技术;2000-05 |
| 8 |
HUANG Chun-yue,ZHOU De-jian (Guilin Institute of Electronic Technology,Guilin 541004,China);Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology[J];电子工艺技术;2000-04 |
| 9 |
YU Chun,ZHOU Xiong hui,ZHANG Yong qing;FEA Oriented Feature based Modeling Technology[J];工程设计;1999-03 |
| 10 |
HAO Ying-zheng WANG Cai-yun (Second Research Institute of Ministry of Electronics Industry,Taiyuan030024,China);General Technology Requirements for Reflow Solderingand Test Way of Temperature Profile[J];电子工艺技术;1999-04 |
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