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《ELECTRONIC COMPONENTS $ MATERIALS》 1995-05
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Research on Thermoanalyzing Technique of HIC by Finite-element Method

Du Lei; Sun Chengyong; HuangJipo; Bao Junlin  
According to thermal characteristics analysis of HIC and then given model/submodel a special set of softwares of thermoanalysis by finite elements of the HIC for microcomputers is developed. Using this set, the thermoanalysis of typical HIC is made, Obtained temperature field distribution confirms validity of the software, because calculated values well corresponds to experiment results given by using thermoimager.
【CateGory Index】: TN45
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