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Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology

HUANG Chun-yue,ZHOU De-jian (Guilin Institute of Electronic Technology,Guilin 541004,China)  
As an example of fine pitch technology,solder joint shapes evolving model of quad flat package based on minimal energy principle and the theory of solder joint shapes was developed, the finite element method was employed to predict solder joint shapes of QFP. And the model was used to analyze the problems of three-dimensional solder joint shapes of QFP.
【CateGory Index】: TN405
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Chinese Journal Full-text Database 3 Hits
1 HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China) ;Research Status of Reflow Soldering Process in SMT[J];Electronics Process Technology;2004-06
2 MAO Xin-long, HAN Guo-ming, HUANG Bing-yuan, et al.(College of Material Science and Engineering, Tianjin University, Tianjin 300072, China);Modeling and simulating of reflow soldering in SMT[J];Welding Technology;2004-06
3 XUE Songbai WU Yuxiu HAN Zongjie WANG Jianxin College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE(QFP)SOLDERED JOINTS[J];机械工程学报(英文版);2007-04
Chinese Journal Full-text Database 1 Hits
1 Zhou Dejian Pan Kailin Wu Zhaohua(Dept. of Eletronic Machinery Engineering);The Modeling and Analyzing of Surface Mount Solder Joints Shapes[J];Journal of Guilin University of Electronic Technology;1997-04
Chinese Journal Full-text Database 8 Hits
1 ZHOU De\|jian, PAN Kai\|lin and LIU Chang\|kang(Guilin Institute of Electronic Technology, Guilin\ 541004, China)Received 21 August 1998, revised manuscript received 5 February 1999;Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint[J];CHINESE JOURNAL OF SEMICONDUCTORS;2000-02
2 Zhou Dejian, Pan Kailin,Wu Zhaohua(Guilin Institute of Electronic Technology, Guilin\ 541004) Chen Zichen(Zhejiang University, Hangzhou\ 310027);Modeling and Predicting Solder Joint Shapes of Ball Grid Array[J];CHINESE JOURNAL OF SEMICONDUCTORS;1999-01
3 YANG Jie,ZHANG Ke-ke,ZHOU Xu-dong,Cheng Guang-hui,MAN Hua(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China);Overview on Solder Joint Reliability in Micro-jointing[J];Electronic Components $ Materials;2005-09
4 Zhou Dejian,Pan Kailin,Wu Zhaohua (Dept.of Electronic Machinery Engineering,Guilin Institute of Electronic Technology,Guilin 541004) Chen Zichen (Dept.of Machinery,Zhejiang University,Hangzhou 310027);Predicting Three Dimensional Solder Joint Shapes of SMT Based on Minimal Energy Principle[J];ACTA ELECTRONICA SINICA;1999-05
5 Liu Changkang Zhou Dejian Pan Kanlin Qin Kuangyu (Dept.of Electronic Machinery Engineering);The Effects of PBGA Solder Evolving Parameters on Thermal Fatigue Life[J];JOURNAL OF GUILIN INSTITUTE OF ELECTRONIC TECHNOLOGY;1998-03
7 WANG Kao CHEN Xun CHU Wei-hua(Research Institute of Mechatronics Engineering, College of Mechatronic Engineering and Automation,National University of Defense Technology, Hunan Changsha, 410073, China);Shape prediction and reliability analysis of QFP solder joint[J];Structure & Environment Engineering;2004-01
8 ZHOU De\|jian\+\{1,2\},CHEN Zi\|chen\+1,PAN Kai\|lin\+\{1,2\},WU Zhao\|hua\+2\;(1.Dept. of Mechaical Engineering, Zhejiang Univ., Hangzhou 310027, China; 2. Dept. of Guilin Institute of Electronic Technology, Guilin 541004, China);Modeling and predicting solder joint shapes of Plastic Ball Grid Array[J];Journal of Zhejiang University(Engineering Science);2000-06
Chinese Journal Full-text Database 10 Hits
1 XIONG Sheng-huf-HUANG Zuof-TIAN Min-bo (Department Of Materials Science and Engineering, Tsinghua University, Beijing 100084, China);The Trend Towards Lead-free in Electronic Packages and Its Choke Point[J];Semiconductor Industry;2004-03
2 ZHOU De\|jian, PAN Kai\|lin and LIU Chang\|kang(Guilin Institute of Electronic Technology, Guilin\ 541004, China)Received 21 August 1998, revised manuscript received 5 February 1999;Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint[J];CHINESE JOURNAL OF SEMICONDUCTORS;2000-02
3 Guo Yuchun;Kuang Jinyu(Department of Radio-Electronics, Beijing Normal Univeroity,100875,Beijing,PRC);A RELAXATION ALGORITHM FOR TEXTURE SEGMENTATION[J];JOURNAL OF BEIJING NORMAL UNIVERSITY;1994-01
4 Cheng Tieshi;Analysis of Crankshaft Rupture Occurrence on Type 1110 Diesel Engine[J];DIESEL ENGINE;1999-05
5 WENG Shou song (WuXi Luo Te Electronic Co., LTD, Wuxi 214002,China);SMT Equipment and PCB Testing Equipment[J];Equipment For Electronic Products Manufacturing;2002-02
6 Xian Fei (Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China);The Factors of Infecting of Quality In Solder-Paste Printing Process[J];Equipment For Electronic Products Manufacturing;2002-03
7 SONG Fu min, ZHANG Xiao li, MA Ru zhen(Guangzhou Yangcheng Science & Technology Enterprises co., ltd, Shenzhen 518057,China);Research to Manufacture of SMT2505 Full Visionand Multifunctional Pick & Equipment[J];Equipment For Electronic Products Manufacturing;2002-04
8 Xian Fei (Fiberhome Telecommunication Technologies Co.,Ltd,Wuhan430074,China);The Technique and Tactic of AOI Technology Used in SMT Production[J];Equipment For Electronic Products Manufacturing;2003-02
9 Xian Fei (Fiberhome Telecommunication Co., Ltd, Hubei Wuhan 430074,China );The Research of Reflow Soldering[J];Electronics & Packaging;2005-03
10 Du Lei; Sun Chengyong; Bao Junling;Modeling of Heat Transfer in the Surface Mounting of Electronic Components During Reflow Process[J];ELECTRONIC COMPONENTS $ MATERIALS;1995-01
【Secondary References】
Chinese Journal Full-text Database 10 Hits
1 WANG Kao,TAO Jun-yong,CHEN Xun (College of Mechatronic Engineering and Automation,National Univ.of Defense Technology,Changsha 410073,China);A Study on the Generating Mechanism of Exciting Signals and the Performance of Vibrators Fixed on Repetitive Shock Machines[J];Journal of National University of Defense Technology;2008-04
2 SHEN Zhen-fang(CETC No.54 Research Instiute,Shijiazhuang 050081,China);Research on Simulation of Reflow Soldering Process of SMT[J];Electronics Process Technology;2009-06
3 YAO Jin-yong JIANG Tong-min Dept. of System Engineering of Engineering Technology, Beijing University of Aeronautics and Astronautics, Beijing, 100083, China;Parameters Calculating and control of Reliability Enhancement Testing Profile based on electric vibrating table[J];Environmental Technology;2006-03
4 L Kehong QIU Jing LIU Guanjun (College of Mechatronics Engineering & Automatization,National University of Defense Technology,Changsha 410073);Fault Prognosis Technology for Solder Joints Based on Time Stress and Hidden Markov Models[J];Chinese Journal of Mechanical Engineering;2008-04
5 WANG Kao TAO Junyong CHEN Xun YI Xiaoshan(College of Mechatronics Engineering and Automatization, National University of Defense Technology, Changsha 410073);Characteristics of Ideal Exciting Signals of Repetitive Shock Machine[J];Journal of Mechanical Engineering;2009-08
6 LU Wu-yi1,WANG Xue-jun1, XIANG Tao1,GUO Yi-an2 (1. School of Information Science and Engineering , Central South University, Changsha 410075 , China; 2. School of Information Science and Engineering, Dalian Maritime University, Dalian 116026, China);Dynamic Modeling and Simulation for Multiple Temperature Zones System of Reflow Soldering Machine Based on Heat Balance Mechanism[J];Hot Working Technology;2006-05
7 Chen Liang, Tian Danbi, Chen Song;SMT Technology for PCB Manufacture[J];Screen Printing;2009-09
8 WANG Kao,TAO Jun-yong,CHEN Xun(Research Institute of Mechatronics Engineering,College of Mechatronic Engineering and Automation,National University of Defense Technology,Changsha410073,China);Improvement of low frequency energy of vibration signal produced by repetitive shock machine[J];Journal of Vibration and Shock;2009-02
9 WANG Kao,TAO Jun-yong,CHEN Xun (College of Mechatronic Engineering and Automation,National University of Defense Technology,Changsha 410073,China);Analysis of exciting signals and their affecting factors of repetitive shock machines[J];Journal of Vibration Engineering;2007-03
10 WANG Kao,TAO Jun-yong,CHEN Xun(College of Mechatronic Engineering and Automation,National University of DefenseTechnology,Changsha 410073,China);Generation mechanism of vibration signals for repetitive shock machines[J];Journal of Vibration Engineering;2008-04
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