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《ELECTRONICS PROCESS TECHNOLOGY》 2000-04
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Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology

HUANG Chun-yue,ZHOU De-jian (Guilin Institute of Electronic Technology,Guilin 541004,China)  
As an example of fine pitch technology,solder joint shapes evolving model of quad flat package based on minimal energy principle and the theory of solder joint shapes was developed, the finite element method was employed to predict solder joint shapes of QFP. And the model was used to analyze the problems of three-dimensional solder joint shapes of QFP.
【CateGory Index】: TN405
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【References】
Chinese Journal Full-text Database 3 Hits
1 HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China) ;Research Status of Reflow Soldering Process in SMT[J];Electronics Process Technology;2004-06
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【Citations】
Chinese Journal Full-text Database 1 Hits
1 Zhou Dejian Pan Kailin Wu Zhaohua(Dept. of Eletronic Machinery Engineering);The Modeling and Analyzing of Surface Mount Solder Joints Shapes[J];Journal of Guilin University of Electronic Technology;1997-04
【Co-citations】
Chinese Journal Full-text Database 8 Hits
1 ZHOU De\|jian, PAN Kai\|lin and LIU Chang\|kang(Guilin Institute of Electronic Technology, Guilin\ 541004, China)Received 21 August 1998, revised manuscript received 5 February 1999;Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint[J];CHINESE JOURNAL OF SEMICONDUCTORS;2000-02
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8 ZHOU De\|jian\+\{1,2\},CHEN Zi\|chen\+1,PAN Kai\|lin\+\{1,2\},WU Zhao\|hua\+2\;(1.Dept. of Mechaical Engineering, Zhejiang Univ., Hangzhou 310027, China; 2. Dept. of Guilin Institute of Electronic Technology, Guilin 541004, China);Modeling and predicting solder joint shapes of Plastic Ball Grid Array[J];Journal of Zhejiang University(Engineering Science);2000-06
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