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《Electronics Process Technology》 2001-06
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Laser Reflow in Electronic Packaging and Assembly

XU Cong,WU Yi-ping,CHEN Ming-hui (Huazhong University of Science and Technology,Wuhan 430074,China)  
Laser reflow is superior to the conventional reflow methods due to its prominent properties such as localized and fast heating, whereas it is less cost-efficient and less productive.Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages,yet it hasn′t been vastly applied presently.Laser fluxless soldering is now under further research.
【CateGory Index】: TN305.93
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