Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Electronics Process Technology》 2004-02
Add to Favorite Get Latest Update

Review of JIS Z 3198: Test Method for Lead-free Solders

WANG Chun-qing,LI Ming-yu,TIAN Yan-hong,KONG Ling-chao(AWPT,Harbin Institute of Technology,Harbin150001,China)  
JIS Z 3198 is an industry standard about test method for lead-free solders and their joints.This standard was proposed initially by Welding Society of Japan,and reviewed by Council of Japan Industry Standard. Finally,the standard was determined by Japan Industry and Economy Ministry and released at 20 June,2003.The standard consists of seven sections such as test method for melting temperature range of lead-free solders,test method for mechanical properties,test method for spreading characteristics,test method for wetting characteristics,test method for tensile and shear strength of solder joints, test method for tensile properties of QFP solder joints,and test method for shear properties of solder joints of sliced devices.Present the contents of every section of the standard according to the original JIS Z 3198 1-7.The purpose is to improve the lead-free process in electronic package and assembly in China.
【CateGory Index】: TG42
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【References】
Chinese Journal Full-text Database 10 Hits
1 XIAO Feng1,TAO Xin1,LIAO Wei1,LIU Lan-xiao1,YANG Ren-hui1,FU Ya2(1 Materials Interfacial Physical-chemistry ResearchInstitute,Chongqing Institute of Technology,Chongqing 400050,China;2 Department ofChemistry,Chongqing Institute of Science and Technology,Chongqing 400042,China);Wettability Analysis of Liquid Epoxy Resin-based Materials with Copper Substrate[J];Journal of Materials Engineering;2007-08
2 HU Yu-hua,XUE Song-bai,CHEN Wen-xue,WANG Hui (College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China);Investigation on the Wettability and Interfacial Structure of Sn-9Zn-xAg Solders on Cu Substrate[J];Journal of Materials Engineering;2009-06
3 HU Zhi-tian,XU Dao-rong (Hefei University of Technology,Hefei 230009,China);Current Status & Prospect Of Lead-Free Solder Alloy[J];Electronics Process Technology;2005-03
4 YANG Zhi~1,SUN Yong~2,YUAN Yi-yao~1(1.Kunming University of Science and Technology,Kunming 650093,China;2.Key Laboratory of Advanced Materials of Yunnan Province,Kunming 650093,China);Study of New-type Sn-Ag-Bi-Cu-In Lead-free Solders[J];Electronics Process Technology;2006-02
5 LI Qun,HUANG Ji-hua,ZHANG Hua,ZHAO Xing-ke,QI Li-hua(University of Science and Technology Beijing,Beijing 100083,China);Influence of Al on Microstructure and Mechanical Properties of the Sn-58Bi Lead-Free Solder[J];Electronics Process Technology;2008-01
6 XU Jun,HU Qiang,LIN Gang,ZHANG Fu-wen(Beijing COMPO Solder Co.,Ltd,Genaral Research Institute forNon-ferrous Metals,Beijing 100088,China);Low Temperature Lead-free Solder and its Developing Tendency[J];Electronics Process Technology;2009-01
7 Lü Juan1,ZHAO Mai-qun1,LU Jia-fei1,WANG Xiu-chun1,Lü Hai-xia2(1.Xi′an University of Technology,Xi′an 710048,China;2.The First Natural Gas Plant of Changqing Oil-fieldConstituent Company,Jingbian 718500,China);Influence of Aging Treatment on Microstructure and Shear Property of Sn-9Zn/Cu Brazed Joint[J];Electronics Process Technology;2009-02
8 ZHANG Yu-hang1,LU Bin2,DAI Xian-bin1,LUO Shi-zhong1,ZHAO Si-yong1,SUN Fu-lin1,GAO Cheng-zhong1(1.Institute of Soldering Material,Guangzhou Research Institute of Non-ferrous Metals,Guangzhou 510650,China;2.Dept.of Material Science and Engineering,Central South University,Changsha 410083,China);Effect of cerium on the structure and properties of Sn-Ag-Cu lead-free solder[J];Materials Research and Application;2007-04
9 XUE Song-bai~1,CHEN Yan~2,LV Xiao-chun~2,LIAO Yong-ping~2(1.Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.Harbin Welding Institute,Harbin 150080,China);Effect of cerium on wettability and mechanical properties of soldered joints for Sn-Ag-Cu lead free solder[J];Transactions of The China Welding Institution;2005-10
10 XUE Song-bai,LIU Lin,DAI Yong-feng,YAO Li-hua(College of Materials Sciences and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China);Effects of rare-earth element Ce on physical properties and mechanical properties of Sn-Ag-Cu lead-free solder[J];Transactions of The China Welding Institution;2005-10
China Proceedings of conference Full-text Database 1 Hits
1 XIAO Feng LIU Lanxiao ZHAO Hongkai YANG Renhui (Materials Interracial Physical-Chemistry Research Institute,Chongqing Institute of Technology,Chongqing 400050);Surface Tension of Liquid Epoxy Resin-based Materials and Their Contact Angle with Copper Substrate[A];[C];2007
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Cao Yu,Yi Dan Qing,Wang Ying ,Lu Bin,Du Ruo xin (Department of Metallurgy Science and Engineering, Central South University,Changsha,Hunan 410083,China) (Industry School of Henan Province,Zhengzhou,Henan,450002,China);The Research and Development of Pb-free Sn-Ag Base Solders[J];Sichuan Nonferrous Metals;2001-03
2 CHENG Li, WANG Zhen-yu, ZHU Jun, ZHAO Qian, SHI Shou-yong, ZHU Yi-yun (Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Summary of WL-CSP technologies & their applications[J];Semiconductor Technology;2005-02
3 GU Xiao-yan,QU Wen-qing,ZHAO Hai-yun,ZHUANG Hong-shou(Mechanical Engineering and Automatic Institute,Beihang University,Beijing 100083,China);Investigation on the Wettability of Sn-Cu Lead-Free Solder in Electronic Packaging[J];Semiconductor Technology;2006-05
4 Chen Junjun,Fu Yuepeng,Tian Minbo(Department of Materials Science and Engineering,Tsinghua University,Beijing 100084,China);Recent Development of Micro Electronic Packaging Materials[J];Semiconductor Technology;2008-03
5 ;Research Progress on Sn-Bi-based Low-temperature Pb-free Solder Alloys[J];Materials Review;1999-03
6 ZHOU Ganyu WANG Changzhen TAN Wei ZHANG Siqi (College of Materials Science and Engineering ,Central South University, Changsha 410083);Progress in Study of Lead-free Solders[J];Materials Review;2003-08
7 ZHANG Shuguang HE Lijun ZHANG Shaoming SHI Likai (Beijing General Research Institute for Non-ferrous Metals,Beijing 100088);Progress of Research and Application of Lead-free Solder[J];Materials Review;2004-06
8 YANG Huijuan WANG Zhifa WANG Haishan MO Wenjian GUO Lei (School of Materials Science and Engineering,Central South University,Changsha 410083);Present Status and Progress in Study of Electronic Packaging Materials[J];Materials Review;2004-06
9 CHEN Fang DU Changhua HUANG Fuxiang DU Yunfei(Dept. of Material Science and Engineering,Chongqing Institute of Technology, Chongqing 400050);Wettabinity of Lead-free Solder Sn-0.7Cu on the Surface of Copper[J];Materials Review;2004-09
10 LI Song ZHANG Tongjun AN Bing (State Key Laboratory of Plastic Forming Simulation and Die & Mould Technology,Huazhong University of Science and Technology,Wuhan 430074);Researches on the Measurement of Alloy Wetting in SMT[J];Materials Review;2005-03
China Proceedings of conference Full-text Database 3 Hits
1 MA Xin, WU Jian xin (R&D Center, Yik Shing Tat Industrial Co. Ltd, Shenzhen 518101);Opinion on the patent problem for Lead-free solder alloys[A];[C];2004
2 ;Growth of IMC in SnAgCu/Cu Interfacial During Thermal Aging and Thermal Cycling[A];[C];2007
3 ;Microjoining Technology in Electronics Packaging and Assembly[A];[C];2001
【Secondary References】
Chinese Journal Full-text Database 10 Hits
1 ZHAO Xiaoyan ZHAO Maiqun SUN Liheng LIU Hongbin HU Jinlin (College of Material Science and Engineering,Xi'an University of Technology,Xi'an 710048);Effect of Single Rare Earth Element Ce and Mixed Rare Earth Element RE on Properties of Sn-Zn-Cu System Lead-free Solder Alloys[J];Materials Review;2007-10
2 HU Yu-hua,XUE Song-bai,CHEN Wen-xue,WANG Hui (College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China);Investigation on the Wettability and Interfacial Structure of Sn-9Zn-xAg Solders on Cu Substrate[J];Journal of Materials Engineering;2009-06
3 LI Hui(School of Mechanical & Electrical Engineering,Changzhou Institure of Technology,Changzhou 213002);Influence of the Properties and Microstructure of SnAgCu Lead-free Solder Containing Trace Rare Earth Elements[J];Journal of Changzhou Institute of Technology;2008-04
4 SHI Jian-wei1, XU Bo1,2, YUAN He-ping1, WANG Hong-ping1 ( 1. Sun East Electronic Technology Company Lt.d, Shenzhen 518103, China 2. Harbin Institute of Technology, Harbin 150001, China );Inspection Method on Solder Joint Quality in SMT[J];Equipment For Electronic Products Manufacturing;2005-09
5 ;Problem and Solution in Lead-free Electronics Assembly(Continued)[J];Equipment for Electronic Products Manufacturing;2006-06
6 SHI Jian-wei,LIANG Yong-jun,WANG Hong-ping ( Sun East Electronic Technology (Shen Zhen) Company Ltd.,518103 );Nitrogen Protection's Effect on Solder Joint Appearance in Lead-free Reflow Soldering[J];Equipment for Electronic Products Manufacturing;2007-10
7 HAN Zong-jie1,XUE Song-bai1,WANG Jian-xin1,ZHANG Liang1,YU Sheng-lin1,2,WANG Hui1,CHEN Wen-xue1 (1.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.The 14th Research Institute,China Electronics Technology Group Corporation,Nanjing 210013,China);Laser soldering technology and its application in SMT[J];Electric Welding Machine;2008-09
8 WANG Hui,XUE Song-bai,CHEN Wen-xue (College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 2100016,China);Effects of Al addition on corrosion resistance and high-temperature oxidation resistance of Sn-9Zn lead-free solder[J];Electric Welding Machine;2008-09
9 ZHAO Xiao-yan, ZHAO Mai-qun, BAI Yan-xia, WANG Xiu-chun, WANG Ya-hui (College of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China);Mechanical Properties and Practical Properties of Sn-Ag-Cu Lead-free Solder Alloys[J];Electronic Components and Materials;2006-10
10 HAN Yun-xia1,ZHANG Ke-ke 2 (1.College of Physics and Electronic Information,Luoyang Normal College,Luoyang 471022,Henan Province,China;2.College of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,Henan Province,China);Effect of silver and rare earths on tensile property of SnAgCuRE lead-free solder[J];Electronic Components and Materials;2008-07
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved