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《Electronics Process Technology》 2004-06
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Research Status of Reflow Soldering Process in SMT

HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China)   
Review the development of reflow soldering and its process in SMT. Discuss the level of establishing reflow soldering process inside and abroad. The modeling and simulation will advance the development of reflow soldering process.
【CateGory Index】: TG44
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【References】
Chinese Journal Full-text Database 7 Hits
1 SHEN Zhen-fang(CETC No.54 Research Instiute,Shijiazhuang 050081,China);Research on Simulation of Reflow Soldering Process of SMT[J];Electronics Process Technology;2009-06
2 SONG Yao-zong,SHI Jian-wei,RAO Shu-min(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China);Research of Hot Air Reflow Oven’s Temperature Controlled System[J];Electronics Process Technology;2011-03
3 LI Na,YU Xin-hong(School of Materials of Northwestern Polytechnical University,Xian 710072,China);Simulation for Lead-free Solder in Ten-zone Reflow Soldering of PCB Assembly[J];Electronics Process Technology;2012-01
4 SUO Xiao-lin,YU Xin-hong(Northwestern Polytechnical University,Xi’an 710072,China);Effect of Electronic Components Placements on Temperatures Field for PCB during Reflow Soldering[J];Electronics Process Technology;2012-03
5 HUANG Chun-guang(HUAWEI TECHNOLOGIES CO.,Ltd.Shenzhen 518129,China);Study on Defects Prventation of Vertical Surface-Mount Module during Reflow Process[J];Electronics Process Technology;2012-04
6 LING Yue-hong(China National Aeronautical Radio Electronics Research Institute,Shanghai 200241,China);Optimizing of Mixed PCB Technology of Reflow Soldering for Aeronautical Product[J];Avionics Technology;2013-01
7 Chen Liang, Tian Danbi, Chen Song;SMT Technology for PCB Manufacture[J];Screen Printing;2009-09
【Citations】
Chinese Journal Full-text Database 8 Hits
1 Du Lei; Sun Chengyong; Bao Junling;Modeling of Heat Transfer in the Surface Mounting of Electronic Components During Reflow Process[J];ELECTRONIC COMPONENTS $ MATERIALS;1995-01
2 Du Lei; Sun Chengyong; Huang Jipo; Bao Junlin;Research on Thermoanalyzing Technique of HIC by Finite-element Method[J];ELECTRONIC COMPONENTS $ MATERIALS;1995-04
3 Du Lei; Sun Chengyong; HuangJipo; Bao Junlin;Research on Thermoanalyzing Technique of HIC by Finite-element Method[J];ELECTRONIC COMPONENTS $ MATERIALS;1995-05
4 HUANG Chun-yue,ZHOU De-jian (Guilin Institute of Electronic Technology,Guilin 541004,China);Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology[J];ELECTRONICS PROCESS TECHNOLOGY;2000-04
5 PAN Kai-lin,ZHOU De-jian,QIN Kuang-yu (Guilin Institute of Electronic Technology,Guilin 541004,China);Study on Simulation of Reflow Soldering Process of SMT[J];ELECTRONICS PROCESS TECHNOLOGY;2000-05
6 HAO Ying-zheng WANG Cai-yun (Second Research Institute of Ministry of Electronics Industry,Taiyuan030024,China);General Technology Requirements for Reflow Solderingand Test Way of Temperature Profile[J];ELECTRONICS PROCESS TECHNOLOGY;1999-04
7 YU Chun,ZHOU Xiong hui,ZHANG Yong qing;FEA Oriented Feature based Modeling Technology[J];ENGINEERING DESIGN;1999-03
8 Harbin Institute of Technology Tian Yanhong, Wang Chunqing;RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY[J];Welding & Joining;2002-06
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 HAN Zong-jie1,XUE Song-bai1,WANG Jian-xin1,ZHANG Liang1,YU Sheng-lin1,2,WANG Hui1,CHEN Wen-xue1 (1.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.The 14th Research Institute,China Electronics Technology Group Corporation,Nanjing 210013,China);Laser soldering technology and its application in SMT[J];Electric Welding Machine;2008-09
2 Xian Fei (Fiberhome Telecommunication Co., Ltd, Hubei Wuhan 430074,China );The Research of Reflow Soldering[J];Electronics & Packaging;2005-03
3 WANG You-shan,SHI Yao-wu,LEI Yong-ping,XIA Zhi-dong(Beijing University of Technology,Beijing 100022,China);Research of Activation Temperature of Rosin-Based Flux for Lead-Free Solder Paste[J];Electronics Process Technology;2005-06
4 SHEN Zhen-fang(CETC No.54 Research Instiute,Shijiazhuang 050081,China);Research on Simulation of Reflow Soldering Process of SMT[J];Electronics Process Technology;2009-06
5 SONG Yao-zong,SHI Jian-wei,RAO Shu-min(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China);Research of Hot Air Reflow Oven’s Temperature Controlled System[J];Electronics Process Technology;2011-03
6 LI Na,YU Xin-hong(School of Materials of Northwestern Polytechnical University,Xian 710072,China);Simulation for Lead-free Solder in Ten-zone Reflow Soldering of PCB Assembly[J];Electronics Process Technology;2012-01
7 WANG Yan, ZHOU DeJian(Dept.of Electronic Machinery and Transportation Engineering,Guilin 541004,China);Study on a Simulated Model of the Reflow Soldering Process[J];Journal of Guilin University of Electronic Technology;2003-05
8 HUANG Chun-guang(HUAWEI TECHNOLOGIES CO.,Ltd.Shenzhen 518129,China);Study on Defects Prventation of Vertical Surface-Mount Module during Reflow Process[J];Electronics Process Technology;2012-04
9 LIU Xu-zhao1,JIA Jian-yuan1,LIU Zhe2,FU Hong-zhi2,WANG Shi-yu2(1 Xidian University,Xi’an 710071,China;2 ZTE Corporation,Shenzhen 518057,China);Simplified Model of Heat Transfer and Analysis of Reflow Soldering Parameters[J];Electronics Process Technology;2012-06
10 HAN Bin;TAN Zhendong;ZHOU Xuan;CHEN Yong;WANG Haiying;LI Mingyu;SHI Jianwei;Shenzhen AIAMD Precision Technology Co., Ltd.;Harbin Institute of Technology Shenzhen Graduate School;Chip Best Automation Technology (Shanghai)Co.,Ltd;;Research Status and Prospect of Laser Soldering Technology in the Field of SMT[J];Equipment for Electronic Products Manufacturing;2014-01
China Proceedings of conference Full-text Database 3 Hits
1 QIU Bao-jun ZHOU De-jian PAN Kai-lin (Guilin Institute of Electronic Techonology,Guilin 541004 China);study on thermal simulation model of solder reflow process[A];[C];2001
2 Wangyan,ZHOU De-Jian (Guilin Institute of Electronic Technology,Guilin 541004 China);Study on a Simplified Model of the Reflow Soldering Process[A];[C];2003
3 Han Bin;Tan Zhendong;Zhou Xuan;Chen Yong;Wang Haiying;Li Mingyu;Shi Jianwei;Shenzhen AIAMD Precision Technology Co.,Ltd.;Harbin Institute of Technology Shenzhen Graduate School;Chip Best Automation Technology (Shanghai)Co.,Ltd,Shezhen Branch;;Research Status and Prospect of Laser Soldering Technology in the field of SMT[A];[C];2014
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 SUN Mei-hua (Department of Mechanical and Electrical Engineering,Nantong Textile Vocational Technology College,Nantong 226007,China);Manual Operating Technology of SMT[J];Semiconductor Technology;2007-08
2 YANG Qi-wei, CHEN Yi (Dept. of Computer, Guilin University of Electronic Technology, Guilin 541004, China);Contrast Research of Universal Temperature Control Methods[J];Ordnance Industry Automation;2005-06
3 Zhang Yumin Beijing Vocational & Technical Institute of Industry, Beijing 100042,China;The Analysis of Some Commen Problems in SMT with Soldering Paste[J];Journal of Beijing Vocational & Technical Institute of Industry;2005-04
4 LI Xiao ming L Shan wei GAO Ze xi (Beijing University of Aeronautics and Astronautics,Dept. of Electronic Engineering);Finite Element Analysis of Temperature Field of PCB and Components[J];JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS;2000-01
5 ZHAO Wenguang, LI Zhongxue, LI Cuiping Civil and Environment Engineering School, UST Beijing, Beijing 100083,China;Integrating VC++, OpenGL and 3DS for Visual Simulation Applications in Engineering[J];Journal of University of Science and Technology Beijing;2001-06
6 Guo Yuchun;Kuang Jinyu(Department of Radio-Electronics, Beijing Normal Univeroity,100875,Beijing,PRC);A RELAXATION ALGORITHM FOR TEXTURE SEGMENTATION[J];JOURNAL OF BEIJING NORMAL UNIVERSITY;1994-01
7 SHI Hong-wei(Dept. of Electronic and Information Engineering, Jiangyin Polytechnic College, Jiangyin 214433, China);On Improving the Quality of SMT Soldering[J];Journal of Changzhou Vocational College of Information Technology;2005-02
8 Zhao Xianghua, Gao Jun,Wang Zhaoan (Xi'an Jiaotong University);A Practical Detecting Circuit for Linear Isolation[J];ELECTROTECHNICAL JOURNAL;2000-10
9 WENG Shou song (WuXi Luo Te Electronic Co., LTD, Wuxi 214002,China);SMT Equipment and PCB Testing Equipment[J];Equipment For Electronic Products Manufacturing;2002-02
10 Xian Fei (Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China);The Factors of Infecting of Quality In Solder-Paste Printing Process[J];Equipment For Electronic Products Manufacturing;2002-03
【Secondary References】
Chinese Journal Full-text Database 5 Hits
1 SUO Xiao-lin,YU Xin-hong(Northwestern Polytechnical University,Xi’an 710072,China);Effect of Electronic Components Placements on Temperatures Field for PCB during Reflow Soldering[J];Electronics Process Technology;2012-03
2 WEI Zi-ling;YIN Hong-rui;Nanjing Tontru Electronic equipment Manufacturing Co. Ltd.;Nanjing Tsingrui feng Tin Industrial Co. Ltd.;;Research of Vertical Line, Surface Printing and Reflow Soldering Process of Electronic Assemblies 3D Structure[J];Electronics Process Technology;2014-01
3 SONG Shunmei;Suneast Electronics Electronics Science and Technology Co.,Ltd.;;The Process Performance Assessment for Reflow Soldering Equipment[J];Equipment for Electronic Products Manufacturing;2014-05
4 PENG Chuanqian;Wuhan Digital Engineering Insititute;;Analysis of Factors Affect on PCB Files Conversion Quality[J];Ship Electronic Engineering;2013-10
5 YANG Qianli;Huazhong University of Science and Technology;;Closed-loop Temperature Control System Based on Digital PID[J];Computer & Digital Engineering;2013-12
【Secondary Citations】
Chinese Journal Full-text Database 9 Hits
1 XU Cong,WU Yi-ping,CHEN Ming-hui (Huazhong University of Science and Technology,Wuhan 430074,China);Laser Reflow in Electronic Packaging and Assembly[J];Electronics Process Technology;2001-06
2 Li Min Feng Zhigang;BGA/MCM Enters Mainstream of the Contemporary Assembly Technology[J];ELECTRONICS PROCESS TECHNOLOGY;1997-05
3 Zhou Dejian Pan Kailin Wu Zhaohua(Dept. of Eletronic Machinery Engineering);The Modeling and Analyzing of Surface Mount Solder Joints Shapes[J];Journal of Guilin University of Electronic Technology;1997-04
4 TIAN Yan hong(National Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology,Harbin 150001,China),WANG Chun qing.;Numerical Simulation on Temperature Distribution of PBGA Package during Laser Reflow Process[J];Transactions of The China Welding Institution;2001-02
5 Wu Zhongke, Wu Junheng (CAD/CAM Research Group,School of Space Technology, Beijing University of Aeronautics and Astronautics,Beijing,100083);BUILD A UNIFIED PRODUCT MODEL WITH COMPLEX METHOD[J];Acta Aeronautica Et Astronautica Sinica;1995-06
6 FENG Li YE Shang Hui(School of Eleclromechanic Engineering Xidian University, Xi′an 710071);NONMANIFOLD GEOMETRIC MODELLINGTECHNIQUES AND APPLICATIONS[J];JOURAAL OF COMPUTER AIDED DESIGN & COMPUTER GRAPHICS;1998-05
7 YU Chun ZHOU Xiong Hui ZHANG Yong Qing (National Die&Mould CAD Engineering Research Center, Shanghai Jiaotong University, Shanghai 200030);THE INTEGRATION OF FEATURE BASED MODELING AND FINITE ELEMENT METHODS[J];JOURAAL OF COMPUTER AIDED DESIGN & COMPUTER GRAPHICS;1999-01
8 TIAN Yanhong, WANG Chunqing (National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001) Correspondent: TIAN Yanhong, assistant professor, Tel:(0451)6413951, Fax:(0451)6416186,;INTERFACIAL REACTION BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu PAD DURING LASER REFLOW[J];Acta Metallrugica Sinica;2002-01
9 ;Prospects of CAD Standardization[J];;1998-05
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