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《Electronics Process Technology》 2006-04
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Study of Sn-8Zn Lead-free Solder Weldability

SHANG Yan-geng,LANG Bo,SUN Da-qian,WU Wen-yun,HUANG Ze-wu(JiLin University,Changchun 130022,China)  
The effects of alloy elements Bi and Ag on the resistance to oxidability and joint shear strength of Sn-8Zn lead-free solder at high-temperature was studied.At high-temperature the change of oxidation film shape and color was observed on the surface of liquid solder by oxidation weight increase △M value method.We analyzed oxidation film by X-ray diffraction analysis and studied high-temperature resistance to oxidability of solder.The reasons of advancing observations of solder structure and joint shear strength were analyzed by experiments of solder joint shear strength after heat treatment.The experimental results indicated that the appropriate addition of alloy elements Bi and Ag could enhance resistance to oxidability at high-temperature and joint shear strength.
【Fund】: 吉林省科技发展计划项目(项目编号:20000518)
【CateGory Index】: TG425
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