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《Electronics Process Technology》 2012-06
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Simplified Model of Heat Transfer and Analysis of Reflow Soldering Parameters

LIU Xu-zhao1,JIA Jian-yuan1,LIU Zhe2,FU Hong-zhi2,WANG Shi-yu2(1 Xidian University,Xi’an 710071,China;2 ZTE Corporation,Shenzhen 518057,China)  
As the crucial process in SMT line,the perfection of the quality and efficiency of the reflow soldering process relies on the optimization and control of the reflow profile.The simulation and prediction of reflow soldering process is increasingly concerned.Describe a new simplified reflow soldering process model,which will be applied to the computer-aided analysis and predict the reflow profile,assisting the reflow soldering process formulation.
【Fund】: 2011产学研合作基金项目
【CateGory Index】: TN605
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Chinese Journal Full-text Database 1 Hits
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Chinese Journal Full-text Database 10 Hits
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