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《Electronics Process Technology》 2012-06
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Simplified Model of Heat Transfer and Analysis of Reflow Soldering Parameters

LIU Xu-zhao1,JIA Jian-yuan1,LIU Zhe2,FU Hong-zhi2,WANG Shi-yu2(1 Xidian University,Xi’an 710071,China;2 ZTE Corporation,Shenzhen 518057,China)  
As the crucial process in SMT line,the perfection of the quality and efficiency of the reflow soldering process relies on the optimization and control of the reflow profile.The simulation and prediction of reflow soldering process is increasingly concerned.Describe a new simplified reflow soldering process model,which will be applied to the computer-aided analysis and predict the reflow profile,assisting the reflow soldering process formulation.
【Fund】: 2011产学研合作基金项目
【CateGory Index】: TN605
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【Citations】
Chinese Journal Full-text Database 1 Hits
1 PAN Kai-lin,ZHOU De-jian,QIN Kuang-yu (Guilin Institute of Electronic Technology,Guilin 541004,China);Study on Simulation of Reflow Soldering Process of SMT[J];ELECTRONICS PROCESS TECHNOLOGY;2000-05
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China) ;Research Status of Reflow Soldering Process in SMT[J];Electronics Process Technology;2004-06
2 WANG You-shan,SHI Yao-wu,LEI Yong-ping,XIA Zhi-dong(Beijing University of Technology,Beijing 100022,China);Research of Activation Temperature of Rosin-Based Flux for Lead-Free Solder Paste[J];Electronics Process Technology;2005-06
3 SHEN Zhen-fang(CETC No.54 Research Instiute,Shijiazhuang 050081,China);Research on Simulation of Reflow Soldering Process of SMT[J];Electronics Process Technology;2009-06
4 SONG Yao-zong,SHI Jian-wei,RAO Shu-min(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China);Research of Hot Air Reflow Oven’s Temperature Controlled System[J];Electronics Process Technology;2011-03
5 LI Na,YU Xin-hong(School of Materials of Northwestern Polytechnical University,Xian 710072,China);Simulation for Lead-free Solder in Ten-zone Reflow Soldering of PCB Assembly[J];Electronics Process Technology;2012-01
6 WANG Yan, ZHOU DeJian(Dept.of Electronic Machinery and Transportation Engineering,Guilin 541004,China);Study on a Simulated Model of the Reflow Soldering Process[J];Journal of Guilin University of Electronic Technology;2003-05
7 HUANG Chun-guang(HUAWEI TECHNOLOGIES CO.,Ltd.Shenzhen 518129,China);Study on Defects Prventation of Vertical Surface-Mount Module during Reflow Process[J];Electronics Process Technology;2012-04
8 MAO Xin-long, HAN Guo-ming, HUANG Bing-yuan, et al.(College of Material Science and Engineering, Tianjin University, Tianjin 300072, China);Modeling and simulating of reflow soldering in SMT[J];Welding Technology;2004-06
9 PAN Kai-lin1,2, ZHOU De-jian1, WU Zhao-hua1, HUANG Chun-yue1(1.Dep. of Mechatronic and Traffic Eng., Guilin Univ. of Electronic Tech., Guilin541004, China;2. Inst. of Advanced Manufacturing Eng., Zhejiang Univ., Hangzhou310027, China);DFM-Oriented Virtual Assembly System for Surface Mount Technology[J];Computer Integrated Manufacturing Systems;2003-05
10 SHA Jian-jun,PAN Er-shun(School of Mechanical Engineering,Shanghai Jiaotong University,Shanghai 200240,China);Soldering Parameter-Setting Approach Based on Improved Adaptive Neuro Fuzzy Inference Model[J];Journal of Shanghai Jiaotong University;2011-12
China Proceedings of conference Full-text Database 2 Hits
1 QIU Bao-jun ZHOU De-jian PAN Kai-lin (Guilin Institute of Electronic Techonology,Guilin 541004 China);study on thermal simulation model of solder reflow process[A];[C];2001
2 Wangyan,ZHOU De-Jian (Guilin Institute of Electronic Technology,Guilin 541004 China);Study on a Simplified Model of the Reflow Soldering Process[A];[C];2003
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