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《Electro-Mechanical Engineering》 2011-03
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Development and Prospect of Micro-electromechanical System

CHEN Yong-hua(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)  
MEMS is a kind of miniature system,which utilizes IC manufacturing together with micro-architecture technologies to implement the integration of micro-structures,micro-sensors,micro-actuators,control/processing circuits and even interfaces,communication,power supplies etc.on one or more chip(s).It is cross-disciplinary frontier technology and has strategic significance.In this paper,the scope,classification and features of MEMS are introduced.The development history of MEMS,the development dynamics and the industrial situation of MEMS technology all over the world are summarized.On this basis,the existing main problems and key technological bottlenecks in MEMS are analyzed.The development trend and hot applications in MEMS field are discussed.Useful revelations are given for MEMS technology research.
【CateGory Index】: TP211.4
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【Citations】
Chinese Journal Full-text Database 2 Hits
1 LU Jing-yu,ZHANG Fei-hu,ZHANG Yong(School of Mechatronics Engineering,Harbin Institute of Technology,Harbin 150001,China);Current status and future prospect of MEMS[J];Transducer and Microsystem Technologies;2008-02
2 ZHANG Dongzhi,HU Guoqing (School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China);Key Technologies of Micro-electromechanical System and Its Recent Progress[J];Piezoelectrics & Acoustooptics;2010-03
【Co-citations】
Chinese Journal Full-text Database 3 Hits
1 ZHANG Jian-jian,ZHU Di,LI Han-song(Jiangsu Key Laboratory of precision and Micro-Manufacturing Technology, Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China);Rapid detection system of multiple micro holes based on digital image processing technology[J];Transducer and Microsystem Technologies;2009-06
2 ZHANG Qiang WU Xiaobo YANG Yang SUN Liang(Institute of VLSI Design,Zhejiang University,Hangzhou,310027,CHN);Design of ROIC in Uncooled Infrared Detector Based on MEMS[J];Research & Progress of SSE;2010-04
3 ZHENG Chao SUN Sheng JI Zhong WANG Wei(Schoo1 of Materials Science and Engineering,Shandong University,Jinan 250061 China);Microscale laser peen forming of sheet metal and its research situation[J];Journal of Plasticity Engineering;2009-04
【Secondary Citations】
Chinese Journal Full-text Database 10 Hits
1 ZHANG Yi,LUO Yuan,XU Xiao-dong(School of Automatization,Chongqing University of Posts and Telecommunications,Chongqing 400065,CHN);Analysis and Simulation for Micro-mirror of MEMS Optical Switch Based on Fractal Theory[J];Semiconductor Optoelectronics;2006-06
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3 CHEN Bing-ya1,2,LIU Ying1,HU Min1,LI Xiao-bing1,LI Yi-bing1,WANG Qiang1(1.School of Mechanical & Electrical Engineering,Nanchang University,Nanchang 330029,China;2.Depavtment of Test and Control Engineering,Nanchang Institute of Aeronautical Technology,Nanchang 330063,China);The Research and Prospect of Microactuator[J];Micronanoelectronic Technology;2005-12
4 Huang Qing’an,Liu Zutao,Li Weihua,and Li Qiaoping(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J];Chinese Journal of Semiconductors;2006-09
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6 SHEN Hong-yuan,CHU Jin-kui,ZHANG Duan-qin,LUO Ru-lin(Key Laboratory for Micro /Nano Technology and System of Liaoning Province,Key Laboratory for Precision & Non-traditional Machining,Ministry of Education,Dalian University of Techonology,Dalian 116023,China);Study of off-chip tensile test experimental facility for micro-component mechanical property[J];Transducer and Microsystem Technologies;2007-07
7 RONG Hua~1,2,HUANG Qing-an~2,WANG Ming~1(1.Jiangsu Province Key Laboratory of Optoelectronic Technology,Nanjing Normal University,Nanjing,Jiangsu 210097,China;2.Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing,Jiangsu 210096,China);A Method for In-Situ Measuring Average Stress Gradient and Elastic Modulus of a MEMS Film[J];Acta Electronica Sinica;2007-02
8 LOU Xia1,JIN Xin2,JIN Yu-feng1,2,LI Zhi-hong2(1.Peking University,Shenzhen Graduate School,Shenzhen 518055,China;2.National Key Laboratory of Nano/Micro Fabrication TechnologyInstitute of Microelectronics,Peking University,Beijing 100871,China);A strategy of wafer-level-plastic-packaging for MEMS based on adhesive bonding[J];Journal of Functional Materials and Devices;2008-02
9 LI Zhi, WANG Xiang-jun (National Laboratory of Precision Measurement Technology and Instruments,College of Precision Instrument and Opto-electronic Engineering, Tianjin University, Tianjin 300072, China);MEMS measurement technologies and methods[J];Optics and Precision Engineering;2003-01
10 WANG Liding~(1,2) CHU Jinkui~(1,2) LIU Chong~(1,2) LUO Yi~2 (1.Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116023;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023);New Developments on Micro-nano Manufacture Technology in China[J];Chinese Journal of Mechanical Engineering;2008-11
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