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《Journal of Electron Devices》 2005-02
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Protection of Circuits in MEMS Post-Processing with ABS

CAO Zheng-jun, QIN Ming (Key Laboratory of MEMS of Ministry of Education, Southeast university,Nanjing 210096, China)  
A new method which uses Acrylonitrile Butadiene Styrene (ABS) films as the mask for anistropic etching to protect the front side of the wafer is proposed. ABS is spin-coated on the surface of the silicon wafer. A series of processes are used to enhance the adhesion of the films. The anti-etching characterization of the films is carried out in KOH solutions and TMAH solutions at different temperatures. The experiment proves that the mask time of ABS films is up to about 10h in the 25wt% TMAH solutions at 90℃. Another advantage of this film is that it can be chemically removed after etching.
【Fund】: 江苏省自然科学基金项目资助(BK2003052);; 国家自然科学基金(60476019)资助
【CateGory Index】: TN05
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