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《Journal of Chongqing University》 2008-09
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The structure of local transgranular deformation in polycrystalline pure aluminium

ZHOU Zheng,FENG Yi,XIAO Mei,ZHANG Xi-yan(College of Materials Science and Engineering,Chongqing University,Chongqing 400030,P.R.China)  
The micro-hardness method was used to achieve plastic deformation in grain scales in polycrystalline pure aluminums.Characteristics of the deformation structure near indentations were investigated before and after annealing.The different morphologies of slipbands near indentation areas were viewed only after annealing.Within the slipband areas the numerous orderly arranged ends of the dislocations were identified.During experiments,we observed the phenomenon of slipbands across aggregate areas in grains.We discuss reasons for not discovering recrystallization in the deformed specimen after annealing.We also discuss factors such as temperature and time of annealing,reduction and grain orientation,which have influence on the formation of slipbands.The experimental results show that,being different from global deformation for materials,the mode of transgranular deformation can be used conveniently to study the morphological features of deformation and recrystallization of polycrystalline materials and related influencing factors.
【Fund】: 国家自然科学基金资助项目(50471086)
【CateGory Index】: TG146.21
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【Citations】
Chinese Journal Full-text Database 9 Hits
1 Yang Tao (Kunming Institute of Precious Metals,Kunming 650221,China);Study of the Indentation Size Effect Influencing Microhardness Measurement[J];PRECIOUS METALS;2000-03
2 Yin Junlin;TEM Observation of Emitting Dislocations from Grain Boundaries in Polycrystalline Copper[J];JOURNAL OF IRON AND STEEL RESEARCH;1998-02
3 ZHOU Bangxin;A STUDY OF THE PREYIELDING MICROSTRAIN IN 3%Si-Fe ALLOY[J];Acta Metallrugica Sinica;1983-01
4 LIN Dongliang;CHEN Da T. L. Lin Shanghai Jiaotong University ,professor,Deportment of Materials Science,Shanghai Jiactong University, Shanghai 200030;SLIP FEATURE AND GRAIN BOUNDARY BEHAVIOURS OF Ni_3 Al ALLOYS DURING DEFORMATION[J];Acta Metallurgica Sinica;1990-03
5 WU Guilin, LIU Wei, A. Godfrey, LIU Qing Department of Materials Science and Engineering, Tsinghua University, Beijing 100084;MICROSTRUCTURAL EVOLUTION OF COLUMNAR GRAIN Al DURING COLD ROLLINGⅠ. Marcoscopic Subdivision[J];Acta Metallrugica Sinica;2004-07
6 CAI Xun; ZHOU Pingnan; (Shanghai Jiaotong University , Shanghai 200030)Bangert H (Technical University of Vienna, Auslria);SIMULATION OF INDENTATION MICROHARDNESS TESTING[J];ACTA METALLRUGICA SINICA;1995-13
7 Li Ming Wen Shizhu (Tsinghua University);THEORETICAL METHODS ON NANOINDENTATION[J];Chinese Journal of Mechanical Engineering;2003-03
8 Zhang Yongwei; Wang Ziqiang (Wang Tzuchiang) (Laboratory for Non-linear Mechanics of Continuous Media (LNM). Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080);ADVANCES IN THE STUDY OF MECHANICAL BEHAVIORS OF MATERIALS BY MOLECULAR DYNAMICS METHOD[J];ADVANCES IN MECHANICS;1996-01
9 Cai Xun, Zhou Pingnan (Department of Materials Science, Shanghai Jiaotong University);Indentation Size Effect on Microhardness and It's Essence[J];JOURNAL OF SHANGHAI JIAOTONG UNIVERSITY;1998-02
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 MI Yan-yu, HU Nai-sai, HE Jia-wen, CHEN Hua;Evaluation of hardness measurement methods for thin films[J];China Surface Engineering;2002-03
2 FU Chen-xin, CHEN Yun-fei (School of Mechanical Engineering, MEMS Key Laboratory of China Educational Ministry, Southeast University, NanJing 210096,China);Molecular Dynamics Simulation of the Stretching Process of Silicon Nano-Rods[J];Chinese Journal of Sensors and Actuators;2006-05
3 ZHOU Liang,YAO Ying-xue(College of Mechanical and Electrical Engineering,Harbin Institute of Technology,Harbin 150001,China);The Compare between Two Micro-Nanohardness Testing Methods[J];Journal of Test and Measurement Technology;2006-01
4 LIU Qi,YAO Yingxue,ZHOU Liang(School of Mechanical and Electrical Engineering,Harbin Institute of Technology,Harbin 150001,China);Theoretical Analysis of Indentation Size Effect[J];Journal of Test and Measurement Technology;2009-01
5 He Zongyan;Hwang Kehchih;Yu Shouwen(Dept.of Engineering Mechanics, Tsinghua Univesity, Beijing,100084);A MULTIPLICATION YIELD MODEL OF POLYCRYSTALLINE METAL AND THE ANALYSIS ON YIELD PHENOMENA[J];ACTA MECHANICA SOLIDA SINICA;1995-02
6 LIU Mei-hua1,2,LI Hong-qi1,WANG Jing3,WANG Jiang-hong2,TONG Jing-wei1(1.Tianjin University,Tianjin 300072,China;2.Tianjin University of Commerce,Tianjin 300134,China;3.Military Traffic Institute,Tianjin 300161,China);Influencing Factors of Nano-indentation Test Precision[J];Materials for Mechanical Engineering;2008-08
7 Kuang Tongchun(Guangdong University of Technology, Guangzhou 510090,PRC)Liu Zhengyi(South China University of Science and Technology, Guangzhou 510641,PRC);The Evaluation of Adhesive Properties and the Meassurement of Intrinsic Hardness of Diamond-Like Carbon Films[J];MATERIALS FOR MECHANICAL ENGINEERING;1996-03
8 Zhou Bangxin;Ma Jimei;Yang Minhua;Zhan Qindi;Tensile Preperties of Zircaloy-4 Plates[J];Nuclear Power Engineering;1988-04
9 ZHOU Liang1,2,YAO Ying-xue1(1.School of Mechanical and Electrical Engineering,Harbin Institute of Technology,Harbin 150001,China;2.School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001,China);Research development of hardness indentation size effect at micro/nano scale[J];Journal of Harbin Institute of Technology;2008-04
10 ZHOU Liang~(1,2),YAO Ying-xue~1(1.School of Mechanical and Electrical Engineering,Harbin Institute of Technology,Harbin 150001,China;2.School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001,China);Progress in Nanoindentation Hardness Calculation and Measurement Methods Research[J];Metrology & Measurement Technology;2006-06
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