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《Powder Metallurgy Industry》 2007-05
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RESEARCH AND DEVELOPMENT OF Mo-Cu ALLOY

HAN Sheng-li,SONG Yue-qing,CUI Shun,XIA Yang,ZHOU Zeng-ling,LI Ming (Beijing General Research Institute for Nonferrous Metals,100088,China)  
Mo-Cu alloy of high thermal conductivity and low thermal expansion coefficient is widely used as electrical packaging material and heat sink material.The properties,fabricating methods,application and development of Mo-Cu alloy are described.The process of densification is summarized.The problems in production are discussed.
【CateGory Index】: TF125.2
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