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《Powder Metallurgy Technology》 2005-02
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PM materials for electronic packaging

Wang Tiejun,Zhou Wuping,Xiong Ning,Liu Guohui(Refractory Materials Branch,AT & M Co.,Ltd.Beijing 100081)  
Basic requirements and present status of electronic packaging materials,production methods and properties of traditional electronic packaging materials such as Al 2O 3 BeO and SiC were described. The characteristics of new electronic packaging materials (AlN,W/Cu,Mo/Cu and SiC/Al, etc.) and recent progress in PM technology were emphasized.
【CateGory Index】: TF125
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