Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Journal of Guilin University of Electronic Technology》 2011-01
Add to Favorite Get Latest Update

Performance analysis on high-power LED packaging modules under different junction temperatures

Liu Lei1,Yang Daoguo1,Zhang Guoqi1,2,You Zhi1(1.School of Mechanical and Electronic Engineering,Guilin University of Electronic Technology,Guilin 541004,China;2.DIMES Centre for System Integration and Reliability,Delft University of Technology,Delft,Netherlands)  
In this paper,the thermal variation characteristic of some parameters for two high-power LED packaging modules,such as forward voltage,luminous flux,CCT,color rending index(Ra) and luminous efficiency,were analyzed experimentally.The experiment results demonstrated that high junction temperature of high-power LED packaging modules would decrease luminous efficiency and have other adverse impacts.Therefore,some effective heat dissipation methods are needed to control LED junction temperature within the reasonable range.
【CateGory Index】: TN312.8
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【Citations】
Chinese Journal Full-text Database 7 Hits
1 LUO Xiao-bing1,2,YANG Jiang-hui3,LIU Sheng2,3(1.School of Energy and Power Engineering;2.Wuhan National Laboratory of Optoelectronics;3.School of Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,CHN);Effect of Temperature and Moisture on LED Reliability and Its Mechanism Analysis[J];Semiconductor Optoelectronics;2009-03
2 LIU Yan-chao1,2,FU Gui-cui1,GAO Cheng1,LI Xi-hui2,WANG Shi-jie21.Department of Project System Engineering,Beihang University,Beijing 100083,China;2.Compound Crystal Technology Co.,Ltd.,Beijing 100083,China;Thermal Analysis of Illumination High-Power LED[J];Chinese Journal of Electron Devices;2008-06
3 TIAN Chuan-jun1,2,ZHANG Xi-yan1,ZOU Jun2,WANG Yan-yan1,2 (1.Institute of Materials Science and Engineering,Changchun University of Science and Technology,Changchun 130022,China;2.Zhejiang Gemcore Technology Co.,Ltd.,Wenzhou 325011,China);Temperature Effect on the Photoelectric Parameter of High-power LED Illumination System[J];Chinese Journal of Luminescence;2010-01
4 WU Hui-ying~(1), QIAN Ke-yuan~1, HU Fei~1, LUO Yi~(1,2) (1.Semiconductor Lighting Lab.Graduate School at Shenzhen,Tsinghua University,Shenzhen 518055,China; 2.State Key Lab on Integrated Optoelectronics,Tsinghua University Beijing 100084,China);Study on Thermal Performances of Flip-chip High-power White LEDs[J];Journal of Optoelectronics.laser;2005-05
5 MA Chun-lei,BAO Chao g University, Hangzhou 310027,China);A novel measuring method of thermal resistance for high power LED[J];Optical Instruments;2005-02
6 PENG Wan-hua~(1.2) (1.COEMA Association of Optoelectronics Device; 2.Xiamen Hualian Electronics Co.,Ltd.Xiamen 361006,China);Situation and Development of Ultra Bright and White LED Industry in China[J];Laser & Infrared;2005-04
7 Mei Yi Chen Yuyang Yuan Chuan Liu Muqing(Fudan University Department of Light Source and Illuminating Engineering, Shanghai 200433);Measurement of LEDs' Temperature Characteristics[J];China Illuminating Engineering Journal;2007-01
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 QIAN Ke-yuan~1,ZHENG Dai-shun~1,LUO Yi~(1, 2)(1.Graduate School at Shenzhen,Tsinghua University,Shenzhen 518055,CHN;2.State Key Laboratory of Integrated Optoelectronics,Tsinghua University,Beijing 100084,CHN);Thermal Dispersion of GaN-based Power LEDs[J];Semiconductor Optoelectronics;2006-03
2 WANG Jin,LIANG Bing-wen(Nanjing Handson Corporation.,LTD,Nanjing 211100,CHN);Simulation of pn Junction Temperature of LED with Finite Element Analysis[J];Semiconductor Optoelectronics;2007-02
3 TANG Zheng-wei,HUANG Qiong,ZHAO Zan-liang,GUAN Ming,LI Qiu-jun,DONG Hui-ning,CAI Xue-mei(College of Electronic Engineering,Chongqing University of Posts and Telecommunications,Chongqing 400065,CHN);An Integrated High-power LED Refrigerated by Semiconductor[J];Semiconductor Optoelectronics;2007-04
4 SONG Guo-hua1,MIAO Jian-wen2,FANG Jing-huai1,FAN Li-ping1,LI Bing-hua3(1.School of Science;2.School of Chemistry and Chemical Engineering,Nantong University,Nantong 226007,CHN; 3.Nantong Yuli Optoelectronics Co.,Ltd,Nantong 226400,CHN);Measurement of LED Thermal Resistance Based on Thermistor[J];Semiconductor Optoelectronics;2007-05
5 DAI Wei-feng,WANG Jun,LI Yue-sheng(Department of Material Science,Fudan University,Shanghai 200433,CHN);Transient Thermal Analysis of High-power LED Package[J];Semiconductor Optoelectronics;2008-03
6 ZHOU Chang-bo1,QIAN Ke-yuan1,LUO Yi1,2(1.Semiconductor Lighting Lab.,Graduate School at Shenzhen,Shenzhen 518055,CHN;2.State Key Lab.on Integrated Optoelectronics,Tsinghua University,Beijing 100084,CHN);Thermal Resistance Evaluation of High Power LED[J];Semiconductor Optoelectronics;2009-01
7 LUO Xiao-bing1,2,YANG Jiang-hui3,LIU Sheng2,3(1.School of Energy and Power Engineering;2.Wuhan National Laboratory of Optoelectronics;3.School of Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,CHN);Effect of Temperature and Moisture on LED Reliability and Its Mechanism Analysis[J];Semiconductor Optoelectronics;2009-03
8 LIN Mei-qiong,CHEN Jian-rong,LIU Rong-qi,ZHUANG Qi-ren(College of Information Science and Engineering,Huaqiao University,Quanzhou 362021,CHN);Experimental Research on Temperature Characteristics of GaN-based White LEDs[J];Semiconductor Optoelectronics;2009-06
9 YANG Shao-hua1,WU Fu-gen2,ZHANG Chun-hua2(1.National Key Laboratory for Reliability Physics of Electronic Product,5th Institute of MII,Guangzhou 510610,CHN;2.Experiment Center,Guangdong University of Technology,Guangzhou 510006,CHN);Analysis of Failure Mechanisms of White LEDs[J];Semiconductor Optoelectronics;2009-06
10 MA Lu,LIU Jing(Key Lab. of Cryogenics,Technical Institute of Physics and Chemistry,Chinese Academy of Sciences,Beijing 100190,CHN);Latest Advancement of Thermal Management for High Power LED[J];Semiconductor Optoelectronics;2010-01
China Proceedings of conference Full-text Database 6 Hits
1 ZOU zhao-gui,WANG Ji-you,LIU Bin,DUAN Ping (College Of Applied Sciences,Beijing University Of Technology,Beijing 100022);Study of spectra characteristics of Dy~(3+)-activated srLaAlO_4 phosphor[A];[C];2010
2 YANG Zhen-zhong MA Zhong-liang (Henan Hengji-Kingsun Optoelectronic Co.,LTD.Zhengzhou Henan 450008);A LED indoor lighting heat dissipation system applying graphite material[A];[C];2009
3 GAO Yu-lin LU Yi-jun CHEN Zhong (Department of Physics,Xiamen University,Xiamen 361005 Xiamen Testing & Certification Center for Solid-State Lighting,Xiamen,Fujian,361005);Measurement problems of thermal resistance on the power LEDs[A];[C];2007
4 Cheng Bei Yin Luqiao Liao Yicheng Zhang Jianhua (Key Laboratory of Advanced Display and System Applications(Shanghai University) of the Ministry of Education & School of Electrical and Mechanical Engineering and Automation Shanghai University Shanghai 200072 China);Development of Single-Channel High-Power LED Thermal Resistance Testing System[A];[C];2009
5 XU Zhong-zheng, WU Jjian-feng,Liu wei, Shen chong (State Key Laboratory of Modern Optical Instrumentation, Zhejiang University, Hangzhou 310027,China);Multi-level power stabilization control system of ultra bright LED[A];[C];2005
6 ;To improve the design of LED heat dissipation and lifetime[A];[C];2013
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 MA Ze-tao~1,ZHU Da-qing~1,WANG Xiao-jun~2(1.National Laboratory of Laser Technology;2.Institute of Microsystems,Huazhong University of Science and Technology,Wuhan 430074,CHN);Thermal Analysis of High-power Light-emitting Diode Packages[J];Semiconductor Optoelectronics;2006-01
2 LI Hua-ping1,2,3,CHAI Guang-yue3,PENG Wen-da3,NIU Han-ben3(1.Xi'an Institute of Optics and Precession Mechanics,Chinese Academy of Sciences,Xi'an 710068,CHN;2.Graduate School of Chinese Academy of Sciences,Beijing 100864,CHN;3.Institute of Optoelectronics,Shenzhen University,Shenzhen 518060,CHN);Package and MCPCB for High-power LEDs[J];Semiconductor Optoelectronics;2007-01
3 ZHANG Jian1,FANG Shuai2,HU Zhi-wen3,XU Xiao-lin1(1.Dept.of Applied Physics;2.School of Computer and Information,Hefei University of Technology,Hefei 230009,CHN;3.School of Computer Science and Engineering,Wenzhou University,Wenzhou 325035,CHN);Optimized Design of the Primary Optical System for LED Packages[J];Semiconductor Optoelectronics;2008-05
4 FANG Liang1,2,ZHONG Qiangang1,HE Jian1,LIU Gaobing1,LI Yanjiong1,GUO Pei1(1 Department of Applied Physics,Chongqing University,Chongqing 400044;2 Key Laboratory of Optoelectronic Technologyand Systems of Ministry of Education China,Chongqing University,Chongqing 400044);Study on the Fabrication and Performance of Aluminum Substrate for Heat Dissipation of High Power LED[J];Materials Review;2011-02
5 WANG Guang-zhou,SHI Yu-jie,LIU Xiao-bao,TANG Li-huan(Information Engineering University,Zhengzhou 450002,China);Principle,Analysis,Modeling and Simulation of a Series-Parallel Resonant Dual Voltage DC/DC Converter[J];Power Electronics;2006-02
6 XU Ming,YIN Bin(Department of Electrical Engineering Hohai University,Nanjing 210098,China);A Phase-shifted Full-bridge ZVS Converter with Auxiliary Branch[J];Power Electronics;2006-04
7 LIU Jiang-hua,WANG Guo-jian,LI Xiao-yan,QI Huai-xuan(Tianjin Design and Research Institute of Electric Drive,Tianjin 300180,China);Design of the Digital Controled LLC Resonant Converter Based on DSPIC[J];Electric Drive;2012-03
8 YANG Liu1,CHEN Zhi-ying2(1.Key Laboratory of Opto-electronic Technology Intelligent Control,Ministry of Education,Lanzhou Jiaotong University,Lanzhou 730070,China;2.School of Automatic and Electronic Engineering,Lanzhou Jiaotong University,Lanzhou 730070,China);A Systematic Approach to Developing Soft Switching PWM Converters[J];Electric Switchgear;2008-04
9 ZHANG Lou-ying, LI Chao-lin (Huai'an College of Information Technology, Huai’an 223003, China);Research on Heat-release Package of LED[J];Electronics & Packaging;2009-05
10 WEN Jia-qi,WANG Xifeng,BIAN Fuqiang,XIA Wei (Dalian Luming Light Science&Technology Co.Ltd,Dalian 116025,Liaoning Province,China);Surface treatment and performance of silicate LED phosphor[J];Electronic Components and Materials;2009-01
【Secondary Citations】
Chinese Journal Full-text Database 7 Hits
1 ZHENG Dai-shun1, QIAN Ke-yuan1, LUO Yi(1,2) (1. Laboratory on Semiconductor Lighting,Graduate School at Shenzhen,Tsinghua University,Shenzhen 518055,CHN; 2. State Key Laboratory on Integrated Optoelectronics,College of Electr onic Engineering,Tsinghua University,Beijing 100084,CHN);Life Test and Failure Mechanism Analyses for High -power LED[J];Semiconductor Optoelectronics;2005-02
2 QIAN Ke-yuan1 , HU Fei1, WU Hui-ying1, LUO Yi~(1,2) (1.Graduate School at Shenzhen, Tsinghua University, Shenzhen 518 057,CHN; 2.State Key Lab. on Integrated Optoelectronics, Tsinghua University, Beijing 100084,CHN);Packaging Technique of High-power White LED[J];Semiconductor Optoelectronics;2005-02
3 MA Ze-tao~1,ZHU Da-qing~1,WANG Xiao-jun~2(1.National Laboratory of Laser Technology;2.Institute of Microsystems,Huazhong University of Science and Technology,Wuhan 430074,CHN);Thermal Analysis of High-power Light-emitting Diode Packages[J];Semiconductor Optoelectronics;2006-01
4 MA Hong-xia1,QIAN Ke-yuan1,HAN Yan-jun2,LUO Yi1,2 (1.Graduate School at Shenzhen,Shenzhen 518057,CHN;2.State Key Lab.on Integrated Optoelectronics,Dept.of Electronic Engineering,Tsinghua University,Beijing 100084,CHN);Thermal Design of GaN-based High-power LED Module[J];Semiconductor Optoelectronics;2007-05
5 ZHANG Cheng-jing,WANG Chun-qing(Microjoining Laboratory,School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China);Thermal Analysis and Design of High-power White LED Package[J];Electronics Process Technology;2007-05
6 WU Hui-ying~(1), QIAN Ke-yuan~1, HU Fei~1, LUO Yi~(1,2) (1.Semiconductor Lighting Lab.Graduate School at Shenzhen,Tsinghua University,Shenzhen 518055,China; 2.State Key Lab on Integrated Optoelectronics,Tsinghua University Beijing 100084,China);Study on Thermal Performances of Flip-chip High-power White LEDs[J];Journal of Optoelectronics.laser;2005-05
7 YU Xingang,LIANG Xingang (Heat Transfer and Energy Conversion,The Key Laboratory of Beijing Municipality,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China);Temperatures and thermal stresses in high-power light emitting diodes[J];Journal of Tsinghua University(Science and Technology);2007-08
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved