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《Journal of Functional Materials》 2004-04
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Progress of the lead-free solder

SHEN Jun, LIU Yong-chang, ZHANG Pei-zhen, GAO Hou-xiu (College of Materials Science & Engineering, Tianjin University, Tianjin 300072,China)  
With the rapid development of electronic assembly industry and improvement of people′s knowledge of environmental nature, lead-free solder, called as "green solder", was urgently expected in the electronic packaging technology. Here recent achievements on the lead-free solder were presented in view of joint manufacturing and structural reliability. Research work on alloying, especially the addition of rare earth, and intermetallics formation in the solder was summarized with an effort to improve the joint performance. Further development of lead-free solder was proposed according to the abundant resource of rare earth in China.
【Fund】: 天津市自然科学基金资助项目(033608811)
【CateGory Index】: TG42
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