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《Journal of Functional Materials》 2015-09
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Amorphous filler metal—new consideration for metallic glass as functional material

ZHANG Chunzhi;LI Huiping;College of Materials Science and Engineering,Shandong University of Science and Technology;  
As a new type of filler metal,amorphous alloy has the liquid-like structure,i.e.long-range disorder and short-range order.Such structural featureenables multiple advantages including high strength,hardness,and corrosion resistance et al.Quenched ribbons can also used for narrow-gap welding.The amorphous filler metal shows prospect in fields such as aerospace,military industry,sport equipment,and electronic instrument and so on.In order to illustrate the significance of amorphous filler metal for the development of brazing technology,the research progress in aspects of composition optimization,characterization of filler metals,processes and methods was reviewed.The faced challenges and investigation tendency of amorphous filler metals were also summarized.
【Fund】: 国家自然科学基金资助项目(51171090 51175302);; 青岛科技计划基础研究资助项目(13-1-4-171-jch)
【CateGory Index】: TG425
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【Citations】
Chinese Journal Full-text Database 10 Hits
1 Yuhua Liu1), Jiandong Hu1), Yaping Zhang1), Zuoxing Guo1) and Yue Yang2) 1) Key Lab. of Automobile Materials, Ministry of Education, College of Materials Science and Engineering, Jilin University, Changchun 130025, China 2) Key Lab. of Advanced Structural Materials, Ministry of Education, Changchun University of Technology, Changchun 130012, China;Joining of Zirconia and Ti-6Al-4V Using a Ti-based Amorphous Filler[J];材料科学技术(英文版);2011-07
2 Zhang Heng Zhang Bangwei Tan zhaosheng Yue zhuyan(Department of physics, Hunan University);The Phase Structure of Welding State for Amorphous Cu_(87.6_x)Ni_(8.3)Sn_(4.1)P_x Brazing Aloloy[J];Rare Metal Materials and Engineering;1992-02
3 Mo Wenjian, Wang Zhifa, Jiang Guosheng, Wang Haishan (Central South University, Changsha 410083,China);Study of a New Type of Au-Ag-Si Intermediate Temperature Eutectic Solder[J];Rare Metal Materials and Engineering;2005-03
4 YU Wei-yuan, LU Wen-jiang, CHEN Xue ding, SON G Qiang (College of Materials Science and Engineering, Gansu Univ . of Tech., Lanzhou 730050, China);Preparation of fast-solidified ribbon solder of Al-Cu-Si and its properties[J];Journal of Gansu University of Technology;2002-02
5 LU Wen jiang, LIU Sheng man, YU Wei yuan, CHEN Xue ding (College of Materials Science and Engineering, Gansu Univ. of Tech., Lanzhou 730050, China);Investigation of vacuum brazing of forged aluminum alloy with rapid-setting solidification Al-Cu-Si brazing ribbons[J];Journal of Gansu University of Technology;2002-03
6 GAN Gui-sheng,DU Chang-hua,GAN Shu-de(School of Materials Science and Engineering,Chongqing University of Technology,Chongqing 400054,China);Development of high-temperature lead-free solder in electronic micro-connection[J];Journal of Functional Materials;2013-S1
7 Haiyan Chen;Jian Cao;Xiaoguo Song;Jiakun Liu;Jicai Feng;State Key Lab of Advanced Welding and Joining,Harbin Institute of Technology;School of Materials Science and Engineering,Harbin Institute of Technology at Weihai;;Characterization,Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr_(55)Cu_(30)Ni_5Al_(10) Bulk Metallic Glass[J];材料科学技术(英文版);2014-07
8 ZHAO Qizhang,YU Jun,ZHAO Hongquan,ZOU Jiasheng(1.Provincial Key Lab of Advanced Welding Technolgy,Jiangsu University of Science and Technology,Zhenjiang Jiangsu 212003,China;2.Shanghai Waigaoqiao Shipbuilding CO.,Ltd,Shanghai 200137,China);Study on Preparation and Wettability of Rapidly-cooled Ribbon Fillers of Al-Si-Cu-Zn[J];Journal of Jiangsu University of Science and Technology(Natural Science Edition);2007-05
9 Gao Fei,Zhu Dong,Xu Xiangping,Zou Jiasheng(Provincial Key Lab of Advanced Welding Technology,Jiangsu University of Science and Technology,Zhenjiang Jiangsu 212003,China);TiZrCuB amorphous brazing metal and its wetting ability on Si_3N_4 ceramic[J];Journal of Jiangsu University of Science and Technology(Natural Science Edition);2011-04
10 Zou Jiasheng,Li Huaqi,Wang Chao(Provincial Key Lab of Advanced Welding Technology,Jiangsu University of Science and Technology,Zhenjiang Jiangsu 212003,China);The strength and microstructure of Cu joints brazed with Cu-P based amorphous brazing filler metal contained B[J];Journal of Jiangsu University of Science and Technology(Natural Science Edition);2012-01
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 LV Nan1,YUAN Xiao-guang2,SHENG Li-yuan3 (1.Zoo of Science and Technology,University of Science and Technology Liaoning,Anshan 114051,China;2.Shenyang University and Technology,Shenyang 110000,China;3.Institute of Metal Research Chinese Academy of Sciences,Shenyang 110000,China);Preparation of rapid solidified Al-Si-Cu-Zn-Re powders and its properties[J];Journal of Anshan University of Science and Technology;2007-01
2 Wang Dezhi, Chen Jianxuan, Teng Pancheng, Zheng Zhenhua,Ji Zhongchang, Huang Ningkang Institute of Nuclear Science and technology, Sichuan University, Chengdu, 610064;EFFECT OF Ni ON WELDING PROPERTY BETWEEN STEEL -BONDED CARBIDE AND ORDINARY CARBON STEEL[J];Ordnance Material Science and Engineering;2001-03
3 Hao Hongqin(lecturer,Dept of Materials Science and Engneering,Xian Jiaotong University,Xi an 710049) ;Jin Zhihao;Wanq Xiaotian;STUDY OF CERAMICS BRAZING[J];ORDNANCE MATERIAL SCIENCE AND ENGINEERING;1994-01
4 LI Chunyuan1),WANG Xitao1),YUAN Wenxia2)1)State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,Beijing 100083,China2)School of Applied Science,University of Science and Technology Beijing,Beijing 100083,China;Properties of Ag-Au-Ge medium temperature solder[J];Journal of University of Science and Technology Beijing;2008-12
5 ZHANG Hui~(1,2),YANG Fuliang~(1,2) (1 School of Materials Science and Engineering,Central South University,Changsha 410083;2 Key Laboratory of Nonferrous Metal Materials Science and Engineering of Ministry of Education,Central South University,Changsha 410083);Low Temperature Silver-based Brazing Solder Prepared by Rapid Quenching Method[J];Materials Review;2008-S3
6 ZHANG Lei1,2,LI Shichun1(1 School of Electromechanical Engineering,China University of Petroleum(Huadong),Dongying 257061;2 School of Electromechanical and Automobile Engineering,Yantai University,Yantai 264005);Calculations of Valence Electron Structure and Cohesive Energy for Intermetallic Compounds in Ni-Ti Alloys[J];Materials Review;2011-10
7 GAO Yong,XIA Zhi-dong,CUI Ying-ya(School of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China);Microstructure of FeCrAl Alloy Vacuum Brazing with Ni82CrSiB Filler Metal[J];Journal of Materials Engineering;2010-10
8 ZHANG Jie 1, NAKA M 2, ZHOU Yu 1(1. School of materials science and engineering, Harbin Institute of Technology, Harbin 150001,China; 2. Joint and Welding Research Institute, Osaka University, Osaka 567-0047, Japan);Microstructure of Si_3N_4/Si_3N_4 joint brazed with (CuZn)_(85) Ti_(15) filling alloy[J];Material Science and Technology;2001-03
9 JIANG Hui-rong, YU Wei-yuan, LU Wen-jiang, CHENG Xue-ding, SONG Chong-yang (College of Materials Science and Engineering, Gansu Univ. of Tech, Lanzhou 730050, China);Embrittlement Research in the Rapid Solidification Al-Cu-Si Ribbons[J];Materials Science and Engineering;2003-05
10 Huang Xiao li Lin Shi Xiao Jimei Uinversity of Science and Technology Beijing Beijing 100083 Chu Jianxin Beijing General Research Institute of Non-Ferrous Metals Beijing 100088;Buffer Layer in Joining of ZrO 2 to Steel 40Cr[J];MATERIALS SCIENCE AND ENGINEERING;1996-03
China Proceedings of conference Full-text Database 1 Hits
1 JIANG Hong, ZHANG Li-jing, YANG Jing (Nanjing University Technology, Nanjing 210009,China);Vacuum brazing for stainless steel[A];[C];2004
【Secondary Citations】
Chinese Journal Full-text Database 10 Hits
1 ZOU Jiasheng~(1,2) XU Zhirong~2 CHU Yajie~2 CHEN Guang~1 (1 Department of Materials Science and Engineering,Nanjing University of Science and Technology,Nanjing 210094; 2 Department of Welding,East China Shipbuilding Institute,Zhenjiang 212003);Characteristics and Application of Amorphous Welding Materials[J];Materials Review;2004-04
2 CAI Jianming LI Zhenxi MA Jimin HUANG Xu CAO Chunxiao (Lab of Titanium Alloys,Beijing Institute of Aeronautical Materials,Beijing 100095);Research and Development of 600℃ High Temperature Titanium Alloys for Aeroengine[J];Materials Review;2005-01
3 Niu Jitai; Zhang Zhongdian;Wang Weiqing ;Kai Guoli; Chang Puhuai; Wang Ruren(Harbin Institute of Technology) (Beijing Manufacture works of Satellite)Bai Fengchen;Zhao Yan(Hei Long Jing School of Mechanical Manufacturing);The Research on Welding Characteristics of Thin wires of NiTi Shape Memory Alloy[J];MATERIAL SCIENCE AND TECHNOLOGY;1995-04
4 Qiulian Zeng 1,2) , Jianjun Guo 1) , Xiaolong Gu 1) , Xinbing Zhao 2) and Xiaogang Liu 1) 1) Zhejiang Province Key laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou 310011, China 2) Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China;Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate[J];材料科学技术(英文版);2010-02
5 YU Jueqi;HUANG Hongwu;HUANG Guixiang;YIN Bangyao(College of Mech. 8 Auto. Engineering) Hunan University, Champha 410082 );MICROMORPHOLOGIES OF Al-Si ALLOY FOR A RAPID SOLIDIFICATION WITH A DOUBLE-ROLLER METHOD[J];CHINESE JOURNAL OF MATERIAL RESEARCH;1998-06
6 Zhou Tao, Tom Bobal , Martin Oud, Jia Song-Hang (Coining of America, LLC 280 N. Midland Ave. Saddle Brook, NJ 07663 USA; Institute of Microelectronics, Tsinghua University, Beijing 100084, China);An Introduction to Eutectic Au/Sn Solder Alloy and Its Preforms in Microelectronics/Optoelectronic Packaging Applications[J];Electronics & Packaging;2005-08
7 FANG Wei-ping,SHI Yao-wu,XIA Zhi-dong,GUO Fu,LEI Yong-ping(College of Material Science and Engineering,Beijng University of Technology,Beijng 100022,China);Development of high-temperature Pb-free solder for power die attachment[J];Electronic Components and Materials;2008-03
8 ZENG Qiu-lian1,3, GU Xiao-long1,2, ZHAO Xin-bing3, CHEN Chao-zhong1, LIU Xiao-gang1 (1. Zhejiang Metallurgical Research Institute Co. Ltd., Hangzhou 310011, China; 2. Asia General Electronics Co. Ltd., Zhejiang Metallurgical Research Institute, Hangzhou 310021, China; 3. Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China);Progress of study on the lead-free of high temperature Pb-rich solder[J];Electronic Components and Materials;2008-08
9 YU Wei-yuan, LU Wen-jiang, CHEN Xue ding, SON G Qiang (College of Materials Science and Engineering, Gansu Univ . of Tech., Lanzhou 730050, China);Preparation of fast-solidified ribbon solder of Al-Cu-Si and its properties[J];Journal of Gansu University of Technology;2002-02
10 LI Gang, LU Wen-jiang, YU Wei-yuan , CHEN Xue-ding (College of Materials Science and Engeering, Lanzhou Univ. of Tech., Lanzhou730050, China);Preparation of new amorphous substitute for silver solder and investigation of its properties[J];;2004-05
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