Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Journal of Functional Materials and Devices》 2003-02
Add to Favorite Get Latest Update

Investegation of mechanical property of LPCVD silicon nitride film with micromachined bridge

ZONG Deng-gang 1,2, WANG Zuan-kai 1, LU De-ren 1, ONG Chung-wo 2, CHEN Gang 3 (1. State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China; 2. Department of Applied Physics, Hong Kong Polytechnic University, Hung Hom, Hong Kong, China; 3. Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China)  
The LPCVD silicon nitride microbridge in the elastic range was investigated using a wedge tip under the nanoindenter by the load-deflection curves of the bridge. Both the substrate deformation and the large deflection were considered in the model, and the Young's modulus was evaluated to be (308.4±24.1) GPa , with the residual stress of (252.9±32.4) MPa and the bending strength (6.2±1.3)GPa.
【Fund】: 国家973重点基础研究发展规划项目(G1999033103);; 香港理工大学智能材料中心"MechanicalpropertiesofMicro-cantileversandMicroelectromechanicalPiezoelectricAcousticMicrophones"项目(1.11.37.A310)
【CateGory Index】: O484
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
Chinese Journal Full-text Database 10 Hits
1 CAO Lang,GE Fengguang(College of Civil Engineering,Hehai University,Nanjing 210098,China);Analytic solution on skew plate bending with simply supported under arbitrary concentrated load[J];Sichuan Building Science;2008-04
2 HU Rui~(1,2),REN Hui-qi~2,YAN Dong-jin~2,ZHANG Bing-rui~3 (1.PLA University of Science and Technology,Nanjing 210007,China;2.The Third Research Institute of Engineer Corps,Headquarters of the General Staff,Luoyang 471023,China;3.Jiangsu Construction Engineering Supervision Bureau,Nanjing 210005,China);Approximate Analysis of Simply-supported Rectangular Slab with Interior Elastic Point[J];Chinese Journal of Underground Space and Engineering;2006-03
3 SONG Hua1,Hu Rui2,REN Hui-qi2,YAN Dong-jin2(1.PLA University of Science and Technology,Nanjing 210007,China;2.The Third Engineer Scientific Research Institute of the Headquarters of the General Staff,Luoyang 471023,China);Vibrant Analysis of Rectangular Slab Simply supported by Internal Elastic Point[J];Chinese Journal of Underground Space and Engineering;2007-04
4 ZHOU Zhu-lin,WU Bo-ming ,HE Zhi-yuan ,DING Shu-zhu (Changzhou Bolong three-dimensional composite material Co., Ltd., Changzhou, Jiangsu 213115);Design and Calculation of Nacelle Cover of 3D Sandwich Composites for Wind Power[J];Fiber Reinforced Plastics;2009-02
5 LIN Wen qiong, YANG Yin tang, WANG Jia you, LI Yue jin(Microelectronics Inst., Xidian University, Xi’an 710071, China);Optimal Design of an E-type SiC Pressure Sensor[J];Journal of Transcluction Technology;2004-04
6 JI Hong-en(Zhengzhou Institute of Techonology,Zhenzhou 450052,China);United solution method on tow opposite ends simply supported tow opposite ends free rectangular plate bending with boundary[J];Journal of Pingdingshan Institute of Technology;2004-04
7 CHEN Yu ji (Civil Architectural Engineering College, Central South University, Changsha 410075, China);The Bending Problem for Thin Plates with Mixed Boundary[J];Journal of Changsha Railway University;2001-02
8 Lin Xiao-ying Liu Li (School of Mechatronics,Beijing Institute of Technology,100081) [;Study on the Stresses of Parabolic Antenna under Axial Load[J];;1999-04
9 LIANG Wei~*,LIU Donghuan(School of Aeronautical Science and Technology,Beijing University of Aeronautics and Astronautics,Beijing100083,China);Vibration analysis of laminated shells with magnetostrictive and viscoelastic layers[J];Acta Materiae Compositae Sinica;2006-06
Chinese Journal Full-text Database 10 Hits
1 MEI Nian-song,HUANG Qing-an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);Beam test structure of MEMS for measuring fracture strength[J];Semiconductor Information;2002-12
2 Nie Meng,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);An In-Situ Extracting Method for Residual Stresses of a Multilayer Film by Full-Field Optical Measurement[J];Chinese Journal of Semiconductors;2005-05
3 XU Li ZHANG Xinghong HAN Jiecai (Center for Composite Materials and Structure,Harbin Institute of Technology,Harbin 150001);Review of NDE of Composite Materials in Aerospace Fields[J];Materials Review;2005-08
4 Xia Yushan Chen Yi Zong Xiangfu Department of Material Science, Fudan University, Shanghai, 200433,CHN)Li Jihe (Shanghai Silicon Materials Factory, Songjiang, Shanghai, 201617, CHN)];Analysis for Mechanism of Soft Damage Gettering[J];RESEARCH & PROGRESS OF SOLIA STATE ELECTRONICS;2000-02
5 HE Ri hui, YE Xiong ying, ZHOU Zhao ying (Tsinghua University, Beijing 100084, China);Measurement of Residual Stress of MEMS Materials[J];Materials For Mechanical Engineering;2001-04
6 GUO Liping1, 2 LI Jizhou1 1 (Neutron Scattering Laboratory, Department of Nuclear Physics, China Institute of Atomic Energy, Beijing 102413) 2 (Beijing Synchrotron Radiation Facility, Institute of High Energy Physics, the Chinese Academy of Sciences, Beijing 100049);Conceptual design and simulation on neutron diffractometer for stress measurement at CARR[J];Nuclear Techniques;2005-03
7 ;In-Situ Test Structures of Micromachined Thin Films[J];Measurement & Control Technology;2002-07
8 WANG Cheng,MA Ying,ZHANG Gui-yan,XIAO Meng-chao,GAN Zhi-hong,MIAO Tong-qun,QIAN Long-sheng (Changchun Institute of Optics,Fine Mechanics and Physics,the Chinese Academy of Sciences,Changchun 130022,China);Analysis of laser measurement for thin-film stress[J];Laser Technology;2005-01
9 CHEN Longqing ZHAO Minghao ZHANG Tong Yi (Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hong Kong, China);THE TESTING METHOD OF MECHANICAL PROPERTIES OF THIN FILMS[J];Journal of Mechanical Strength;2001-04
10 Han Wei;Actuality and Development of Non-destructive Testing[J];Programmable Controller & Factory Automation;2005-01
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved