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《Journal of Functional Materials and Devices》 2008-02
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A strategy of wafer-level-plastic-packaging for MEMS based on adhesive bonding

LOU Xia1,JIN Xin2,JIN Yu-feng1,2,LI Zhi-hong2(1.Peking University,Shenzhen Graduate School,Shenzhen 518055,China;2.National Key Laboratory of Nano/Micro Fabrication TechnologyInstitute of Microelectronics,Peking University,Beijing 100871,China)  
A strategy for MEMS wafer level packaging utilizing Epo-Tek 301 as a adhesive layer in bonding is developed.The plastic packaging cap is formed by hot-embossing and is trimmed into 4-inch scale wafer by laser.Then plastic wafer and silicon wafer can be bonded together with a layer of optimized 12μm thick adhesive without any pressure or heat.Little stress is introduced during this process and bonding strength could meet most applications.Wafer dicing is finished in two steps.PMMA is diced with laser,and silicon is diced mechanically.Microfluidic chips packaged in this way have gotten through test.For its simple process and low cost,this strategy can be utilized both for MEMS packaging and temporary dicing protection.
【Fund】: 国家自然科学基金资助项目(No.50075000No.60377000);; 教育部优秀青年教师教学科研奖励基金资助项目
【CateGory Index】: TB48
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Chinese Journal Full-text Database 8 Hits
1 Huang Burning(Shunde Qinchuan Henli Plastic Machinery Co. Ltd. , Shunde 528300, China)Xu Zhongbin (School of Industrial Equipment and Control Engineering, South China University of Technology , Guangzhou 510641 , China);TECHNICAL ADVANCE AND DEVELOPING TREND OF HIGH SPEED ULTRA-PRECISION INJECTION MACHINE[J];Engineering Plastics Application;2002-12
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6 DU Li-qun1,ZHU Shen-miao2(1.Key Laboratory for Precision & Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116023,China;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China);Study on internal stress of thick SU-8 layer in MEMS[J];Optics and Precision Engineering;2007-09
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8 YAO Li-ying~1,ZHANG Yu~1,CHEN Tao~1,WANG Sheng-qi~2,ZUO Tie-chuan~1 1.College of Laser Engineering,Beijing University of Technology,Beijing 100022,China;2.Beijing Institute of Radiation Medicine,Beijing 100057,China;Thermal bonding technology for PMMA based micro flow through PCR chip[J];Laser Journal;2006-01
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