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《Materials for Mechanical Engineering》 2006-10
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Solvent Debinding Process of Ti(C,N) Based Cermet Powder Injection Molding

YAN Ming-shuang, XIONG Wei-hao, FAN Chou, WEI Jing (Huazhong University of Science and Technology, Wuhan 430074, China)  
The solvent debinding process of three different wax-based binders in Ti(C, N) based cermet powder injection molding was studied Effects of debinding temperature, debinding time, sample thickness, solvent types and solvent concentration on binder removal were investigated. Also, the dimension change of samples during the solvent debinding process and the maximal binder removal of dissoluble component were studied elementarily. The solvent debinding quality of the samples based on 3# binder system was the best, and these samples were more suitable for solvent debinding. More than 70% paraffin waxes were removed and open pore channels were formed basically when the samples based on 3# binder system were immersed in heptane for 6 h at 50℃.
【Fund】: 国家自然科学基金资助项目(50074017)
【CateGory Index】: TF124.39
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