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《Optics and Precision Engineering》 2004-02
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Relationship between average etching velocity and laser pulse energy density during excimer laser direct etching

WEI Ren-xuan1,JIANG De-sheng1,ZHOU Zu-de2 (1.Fiber Optic Sensing Technology Research Center, Wuhan University of Technology,Wuhan 430070, China;2.Mechanics and Electronics Institute, Wuhan University of Technology, Wuhan430070, China)  
In order to search for an economical high depth-width ratio micro-fabrication method and build up an excimer laser direct etching system, the relationship between average etching velocity and laser pulse energy density during excimer laser direct etching was investigated by using KrF excimer laser with a wavelength of 248 nm to ablate and etch glass material accurately located with a high-precision micro-motion controlling system. Experimental results showed that all the yielded grooves are V-grooves; the single laser pulse etching velocity decreases as the number of laser pulses increases; the depth of the yielded grooves becomes constant when the laser pulses add up to a definite number, there is an upper limit threshold for excimer laser pulse energy density in the etching process; and rectangular deep grooves or cylindrical deep holes can be produced by using parallel laser beams or dynamic control of etching process.
【CateGory Index】: TG665
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8 YAN Shuhua, DAI Yifan, L Haibao, LI Shengyi(College of Mechatronics Engineering and Automation, National University of Defense Technology, Changsha410073, China) ;Eliminating pixelilation effect in electro-addressable spatial light modulator using beam shaping elements arrays[J];Optical Technology;2003-02
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