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《Optics and Precision Engineering》 2010-10
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Electroless nickel plating of thin copper mesh on K9 substrate

LIU Xiao-han1,2,FENG Xiao-guo1,ZHAO Jing-li1,GAO Jing-song1(1.Key Laboratory of Optical System Advanced Manufacturing Technology,Changchun Instituteof Optics and Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun 130033,China;2.Graduate University of Chinese Academy of Sciences,Beijing 100039,China)  
In order to improve the electromagnetic shielding performance of a high transparency metallic mesh and to enhance its environment resistance, some experiments of electroless Ni plating on a thin copper mesh with a 9 μm line width,0.3 μm thickness and 400 μm×400μm period were carried out.Firstly,a sample of thin copper mesh on a K9 substrate was fabricated by the processes of coating photoresist,laser direct writing,developing,vacuum coating and removing photoresist.Then,the sample was cleaned by the supersonic wave,and was immersed about 10 s to 15 s by a 10% hydrochloric acid solution to activate the copper.After that,the sample was immersed again by an electroless nickel plating solution prepared according to a standard,and was maintained about 40 min to 60 min on a constant temperature condition of 85 ℃.Finally,the sample was taken out from the solution,and was baked by a cabinet drier.Experimental results indicate that the coating is homogeneous and strong joined,and the average electromagnetic shield effectiveness of the mesh is approximately 32 dBm when it is tested by a coaxial test method,which has increased by 11 dBm as compared with that test value before nickel-plating.Furthermore,the optical transmission of the mesh reduces less than 1%from 400 nm to 800 nm after nickel-plating.It is concluded that the nickel can be plated for a thin copper mesh,and can increase fairly the electromagnetic shielding effectiveness of the mesh without effect on the optical transmission.
【Fund】: 国防科技预研基金资助项目(No.10.4.2.ZK1001)
【CateGory Index】: TQ153.12
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