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《Welding & Joining》 2002-06
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RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY

Harbin Institute of Technology Tian Yanhong, Wang Chunqing  
Development of advanced electronic package devices promoted the study on the reflow soldering. In this paper, development of electronic packages was described briefly first, then the most popular reflow soldering methods were discussed. A potential reflow method-laser reflow soldering was expatiated in detail.
【CateGory Index】: TG44
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