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《Aeronautical Manufacturing Technology》 2003-04
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Ultra-Precision Machining Technology of Functional Ceramics

The current state of the ultra precision machining technology of functional ceramics at home and abroad and the machining method are introduced. The principle of the ultra precision polishing technology and its effect on the product quality are described. The development trend of ultra precision polishing technology is indicated.
【Fund】: 浙江省自然科学基金 (5 0 10 97);; 浙江省青年科技人才培养专项资金(RC0 2 0 66);; 浙江省科技厅重点项目(2 0 0 3C2 10 3 6)资助
【CateGory Index】: TQ174
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Chinese Journal Full-text Database 2 Hits
1 YU Jianhai(The Center of Experiment, Zhejiang Vocational and Technologicl College of Economy, Huangzhou 310018, China);Status and Development Tendency of the Ball Rubbing Machine of Ultra-precision Functional Ceramics[J];Journal of Huzhou Vocational and Technological College;2005-02
2 ;The Comparative Study on Super-smooth Surface Performance Measurements Based on Three Different Materials[J];Metrology & Measurement Technique;2009-10
Chinese Journal Full-text Database 10 Hits
1 Tang Yan ju,Miao En ming, Chan Xiao huai;Analysis of Relation of Coefficient of Thermal Expansion and Elastic Modulus[J];Journal of Anhui Textile Vocational Technical Institute;2003-01
2 CHEN Zhi-gang, CHEN Yang, CHEN Ai-lian ( School of Material and Engineering; School of Mechanical Engineering, Jiangsu Polytechnic University, Changzhou 213016,China);Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer[J];Semiconductor Technology;2006-02
3 CHEN Yang1,LI Xia-zhang2,CHEN Zhi-gang1(1.Department of Material Science and EngineeringJ,iangsu Polytechnic University,Changzhou 213016,China;2.School of Material and Engineering,Jiangsu University,Zhenjiang 211013,China);Study on the CMP Property of GaAs Wafer Using Nano Cerium Dioxide Abrasive[J];Semiconductor Technology;2006-04
4 Lü Fei,Wang Yunbiao,Zhang Weicai,Wu Yongchao,Zhao Quan(The 46th Research Institute,CETC,Tianjin 300220,China);Effect of Polishing Processes on the Roughness of GaAs Wafers[J];Semiconductor Technology;2009-08
5 Guo Xiaoguang,Guo Dongming,Kang Renke,and Jin Zhuji(Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116023,China);Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation[J];Journal of Semiconductors;2008-06
6 Wang Wei Yun Chao Sun Kun Wang Yuanyuan(School of Mechanical Engineering and Automation,Beijing University of Aeronautics and Astronautics,Beijing 100191,China);Accurate tool calibration for robotic conformance grinding system[J];Journal of Beijing University of Aeronautics and Astronautics;2009-06
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8 Luo Hongyun 1 Jiao Hong 2 Fan Meng 2 Wang Lijiang 3 (1.School of Mechatronic Engng,Jilin Inst.of Technol,Changchun)(2.Science and Research Department of Jilin Inst.of Technol,Changchun)(3.School of Mechalnic Engng.,Jilin University of Technol, Cha;Diamond tools & Precision Machining and Ultra-precision Machining Technique[J];JOURNAL OF CHANGCHUN INSTITUTE OF OPTICS AND FINE MECHANICS;2000-01
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10 LIANG Shuqing,GONG Baixiang,JING Dan(Changchun University of Technology,Academy of Mechanic and Electronic Engineering,Changchun 130012);Application Research on Micro-displacement Mechanism Composed of Piezoelectric Actuator and Flexible Joint[J];;2006-02
Chinese Journal Full-text Database 10 Hits
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2 KANG Ren-ke,GUO Dong-ming, HUO Feng-wei, JIN Zhu-ji(School of mechanical engineering, Dalian University of Technology, Dalian,116024 China);Application and evolution of back grinding technology for large size wafer[J];Semiconductor Technology;2003-09
3 SU Jian-xiu, KANG Ren-ke, GUO Dong-ming(School of Mechanical Engineering, University of Dalian Technology, Dalian 116024,China);Technology analysis of wafer chemical mechanical polishing in the manufacture of ULSI[J];Semiconductor Technology;2003-10
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10 Fan Jingfeng; Shang Chunmin; Tian Chunlin (Development Center of Science and Technology, Changchun Inst. Optics and Fine Mech.);Scratch on Stainless Steel Surface Lapped with Solid - abrasive[J];Journal of Changchun Institute of Optics and Fine Mechanics;2001-01
【Secondary References】
Chinese Journal Full-text Database 8 Hits
1 LI Bao-gui1,LI Cheng-gui1,LIU Yi2,YANG hui2(1.School of Instrumentation Science and Opto-electronics Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100083,China; 2.Key Laboratory of Ultra-precision Machining for Defence Science and Technology,Beijing University of Aeronautics and Astronautics,Beijing 100083,China);Effect of acid alkali degree on quality of super smooth surface[J];Materials Science and Technology;2009-01
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6 Yang Weiping1,2,Xu Jiawen1,Wu Yongbo3 (1.College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics & Astronautics,Nanjing,210016,China;2.College of Engineering,Jiangxi Agricultural University,Nanchang,330045,China;3.Department of Machine Intelligence and Systems Engineering,Akita Prefectural University,Akita,015-0055,Japan);Chemical-Mechanical Polishing Principle and Experimental System of Ultrasonic Elliptic Vibration[J];Journal of Nanjing University of Aeronautics & Astronautics;2008-06
7 ;The Comparative Study on Super-smooth Surface Performance Measurements Based on Three Different Materials[J];Metrology & Measurement Technique;2009-10
8 Liu Renxin1 Yang Weiping1 Wu Yongbo2(1.College of Engineering,Jiangxi Agricultural University,Nanchang 330045,China2.Department of Machine Intelligence and Systems Engineering,Akita Prefectural University,Akita 015-0055,Japan);Experiment on Silicon Wafer Edge Hybrid Polishing of Ultrasonic Vibration and Chemical Mechanical[J];Transactions of the Chinese Society for Agricultural Machinery;2010-02
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