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《Aeronautical Manufacturing Technology》 2003-04
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Ultra-Precision Machining Technology of Functional Ceramics

The current state of the ultra precision machining technology of functional ceramics at home and abroad and the machining method are introduced. The principle of the ultra precision polishing technology and its effect on the product quality are described. The development trend of ultra precision polishing technology is indicated.
【Fund】: 浙江省自然科学基金 (5 0 10 97);; 浙江省青年科技人才培养专项资金(RC0 2 0 66);; 浙江省科技厅重点项目(2 0 0 3C2 10 3 6)资助
【CateGory Index】: TQ174
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【References】
Chinese Journal Full-text Database 2 Hits
1 YU Jianhai(The Center of Experiment, Zhejiang Vocational and Technologicl College of Economy, Huangzhou 310018, China);Status and Development Tendency of the Ball Rubbing Machine of Ultra-precision Functional Ceramics[J];Journal of Huzhou Vocational and Technological College;2005-02
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【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 Tang Yan ju,Miao En ming, Chan Xiao huai;Analysis of Relation of Coefficient of Thermal Expansion and Elastic Modulus[J];Journal of Anhui Textile Vocational Technical Institute;2003-01
2 CHEN Zhi-gang, CHEN Yang, CHEN Ai-lian ( School of Material and Engineering; School of Mechanical Engineering, Jiangsu Polytechnic University, Changzhou 213016,China);Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer[J];Semiconductor Technology;2006-02
3 CHEN Yang1,LI Xia-zhang2,CHEN Zhi-gang1(1.Department of Material Science and EngineeringJ,iangsu Polytechnic University,Changzhou 213016,China;2.School of Material and Engineering,Jiangsu University,Zhenjiang 211013,China);Study on the CMP Property of GaAs Wafer Using Nano Cerium Dioxide Abrasive[J];Semiconductor Technology;2006-04
4 Lü Fei,Wang Yunbiao,Zhang Weicai,Wu Yongchao,Zhao Quan(The 46th Research Institute,CETC,Tianjin 300220,China);Effect of Polishing Processes on the Roughness of GaAs Wafers[J];Semiconductor Technology;2009-08
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8 Luo Hongyun 1 Jiao Hong 2 Fan Meng 2 Wang Lijiang 3 (1.School of Mechatronic Engng,Jilin Inst.of Technol,Changchun)(2.Science and Research Department of Jilin Inst.of Technol,Changchun)(3.School of Mechalnic Engng.,Jilin University of Technol, Cha;Diamond tools & Precision Machining and Ultra-precision Machining Technique[J];JOURNAL OF CHANGCHUN INSTITUTE OF OPTICS AND FINE MECHANICS;2000-01
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10 LIANG Shuqing,GONG Baixiang,JING Dan(Changchun University of Technology,Academy of Mechanic and Electronic Engineering,Changchun 130012);Application Research on Micro-displacement Mechanism Composed of Piezoelectric Actuator and Flexible Joint[J];;2006-02
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1 DI Wei-guo1, LIU Yu-ling1, SI Tian-hua2(1.Hebei University of Technology, Tianjin 300130,China;2.Luoyang Single Crystal Silicon Factory,Luoyang 471009,China);Chemomechanical polishing technique of silicon substrate in ULSI[J];Semiconductor Technology;2002-07
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【Secondary References】
Chinese Journal Full-text Database 8 Hits
1 LI Bao-gui1,LI Cheng-gui1,LIU Yi2,YANG hui2(1.School of Instrumentation Science and Opto-electronics Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100083,China; 2.Key Laboratory of Ultra-precision Machining for Defence Science and Technology,Beijing University of Aeronautics and Astronautics,Beijing 100083,China);Effect of acid alkali degree on quality of super smooth surface[J];Materials Science and Technology;2009-01
2 ZHANG Ju-fan,WANG Bo,DONG Shen (Center for Precision Engineering,Harbin Institute of Technology,Harbin 150001,China);Application of atmospheric pressure plasma polishing method in machining of silicon ultra-smooth surface[J];Optics and Precision Engineering;2007-11
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4 Li Zhonghui,Postgraduate,Mechanical Engineering College of Donghua University,Shanghai 201620,China Yang Jianguo,Qiu Mingjun;Technology Research and Quality Control for Magnetorheological Finishing[J];Tool Engineering;2010-03
5 Wang Jun Li Jun Zhu Yongwei Lin Kui Li Mao(Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology,Nanjing Universityof Aeronautics & Astronautics,Jiangsu 210016,China);Experimental study on polishing of mobile phone panel glass with unfixed-abrasive and fixed-abrasive pad[J];Diamond & Abrasives Engineering;2009-02
6 Yang Weiping1,2,Xu Jiawen1,Wu Yongbo3 (1.College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics & Astronautics,Nanjing,210016,China;2.College of Engineering,Jiangxi Agricultural University,Nanchang,330045,China;3.Department of Machine Intelligence and Systems Engineering,Akita Prefectural University,Akita,015-0055,Japan);Chemical-Mechanical Polishing Principle and Experimental System of Ultrasonic Elliptic Vibration[J];Journal of Nanjing University of Aeronautics & Astronautics;2008-06
7 ;The Comparative Study on Super-smooth Surface Performance Measurements Based on Three Different Materials[J];Metrology & Measurement Technique;2009-10
8 Liu Renxin1 Yang Weiping1 Wu Yongbo2(1.College of Engineering,Jiangxi Agricultural University,Nanchang 330045,China2.Department of Machine Intelligence and Systems Engineering,Akita Prefectural University,Akita 015-0055,Japan);Experiment on Silicon Wafer Edge Hybrid Polishing of Ultrasonic Vibration and Chemical Mechanical[J];Transactions of the Chinese Society for Agricultural Machinery;2010-02
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