Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Measurement & Control Technology》 2002-07
Add to Favorite Get Latest Update

In-Situ Test Structures of Micromachined Thin Films

Internal stresses in micromachined thin films have a great influence on the properties of MEMS devices.Measurement of stresses in the films is critical for process monitoring and MEMS design.In situ test structures and methods for the films are introduced.Comparison of various methods is given,which is valuable to the design of the MEMS test structures.
【CateGory Index】: TP274
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【References】
Chinese Journal Full-text Database 3 Hits
1 Liu Zutao,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);An Optimized Micro-Rotating Structure for Measuring Residual Strain of Thin Films[J];Chinese Journal of Semiconductors;2005-05
2 Wang Shasha1,Chen Jing 1,,Li Dachao2,Huang Yubo2,and Li Zhihong1(1 National Key Laboratory of Micro/Nano Fabrication Technology,Institute of Microelectronics, Peking University,Beijing 100871,China) (2 State Key Laboratory of Precision Measurement Technology and Instruments,Tianjin University,Tianjin 300072,China);A Highly Sensitive Local Curvature Metrology for Internal Stress Detection in Thin Films[J];Chinese Journal of Semiconductors;2006-06
3 ZHOU Si,CHEN Xun-chi,ZHOU Hui-jun,WANG Si-hui(Department of Physics,Nanjing University,Nanjing 210089,China);Measuring the axial stress in elliptic aluminum film using interference method[J];Physics Experimentation;2008-09
China Proceedings of conference Full-text Database 1 Hits
1 Liu Zutao Huang Qing'an Li Weihua Key Lab of MEMS of Education Ministry, Southeast University, Nanjing,210096;Measurement System for In Situ Extracting Material Parameters of Polysilicon Film[A];[C];2005
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 LIN Xiao-chun~(1), GUO Yan-yan~( 2 ), XIANG Jian-yong~(1), ZHEN Ya-e~(2) (1. School of Technical Physics; 2. School of Science, Xidian University, Xi'an 710071, CHN);A New Device for Real Time Measurement of Thin Film Stress[J];Semiconductor Optoelectronics;2004-01
2 MEI Nian-song,HUANG Qing-an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);Beam test structure of MEMS for measuring fracture strength[J];Semiconductor Information;2002-12
3 ZHU Chang-chun,ZHAO Hong-po,HAN Jian-qiang,CUI Wan-zhao (Institute of Vacuum Microelectronics,School of Electronics and Information Engineering,Xian Jiaotong University,Xian710049,China);The residual stresses in MEMS thin films[J];Micronanoelectronic Technology;2003-10
4 MEI Nian song,HUANG Qing an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);A new structure for measuring MEMS films fracture strength——thermal actuator[J];Micronanoelectronic Technology;2003-Z1
5 XU Gao bin,HUANG Qing an (Key Lab of MEMS of Education Ministry,Southeast University,Nanjing210096,China);Test structure for determination of thermal conductivity of surface micromachined polysilicon thin films[J];Micronanoelectronic Technology;2003-Z1
6 Mei Niansong and Huang Qing'an(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Modeling and Simulation of a Test Structure for Measuring Vertical Fracture Strength of MEMS Film[J];Chinese Journal of Semiconductors;2004-01
7 Xu Gaobin and Huang Qing'an.(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Design and Simulation of On-Line Test Structure for Thermal Conductivity of Polysilicon Thin Films[J];Chinese Journal of Semiconductors;2004-04
8 Lin Xiaochun 1,Guo Yanyan 2,Hu Zhimin 1,Li Chunzhi 2,Zheng Yae 2 and An Yuying 1(1 School of Technical Physics,Xidian University,Xi'an 710071,China) (2 School of Science,Xidian University,Xi'an 710071,China);A Kind of Thin-Film Stress Sensor Based on Beam-Focusing Multi-Beam Array[J];Chinese Journal of Semiconductors;2004-11
9 Nie Meng,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);An In-Situ Extracting Method for Residual Stresses of a Multilayer Film by Full-Field Optical Measurement[J];Chinese Journal of Semiconductors;2005-05
10 AN Bing,ZHANG Tong\|jun,YUAN Chao,CUI Kun ;Stress Measurement of Thin Films by Substrate Curvature Method[J];Materials Protection;2003-07
【Secondary References】
Chinese Journal Full-text Database 5 Hits
1 Huang Qing’an,Liu Zutao,Li Weihua,and Li Qiaoping(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J];Chinese Journal of Semiconductors;2006-09
2 DU Li-qun1,ZHU Shen-miao2(1.Key Laboratory for Precision & Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116023,China;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China);Study on internal stress of thick SU-8 layer in MEMS[J];Optics and Precision Engineering;2007-09
3 HUANG Yu-bo1,LI Da-chao1,HU Xiao-tang1,FU Xing1,ZHANG Wen-dong2,HU Chun-guang1(1.State Key Laboratory of Precision Measuring Technology and Instruments,Tianjin University,Tianjin 300072,China;2.National Key Laboratory for Electronic Measurement Technology,North University of China,Taiyuan 030051,China);Curvature measurement of micro cantilever based on phase-stepping microscopic interferometry[J];Optics and Precision Engineering;2007-09
4 DU Li-qun1,2,ZHU Shen-miao2,YU Li-chuan2 (1.Key Laboratory for Precision & Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology,Dalian 116024,China);Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist[J];Optics and Precision Engineering;2008-03
5 ZHU Shen-miao1,2,DU Li-qun1,2,LIU Chong1,YU Li-chuan2,WANG Zhi-hong1(1.Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116023,China;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China);Application of Fuzzy Neural Network in the Internal Stress of SU-8 Photoresist[J];Nanotechnology and Precision Engineering;2007-04
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved