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《Chemical Engineering(China)》 2016-04
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Chemical kinetics for copper dissolution process in alkaline ammonia solution

LIANG Wei;School of Real Estate,Beijing Normal University,Zhuhai;  
Alkaline ammonia solution is widely used as etching solution in industries of printed circuit board.However,it is lack of kinetics research for copper solution process in etching solution. Simulation experiment method was employed to investigate the chemical kinetics characteristics of copper solution reaction. When velocity gradient G was over 7 570 s~(- 1),copper dissolution rate was not influenced by mass transfer rate determined by stirring intensities. In first 120 s of the reaction,the average mass of copper dissolution per unit area kept linear relation with reaction time. The kinetic constant of the reaction was about 0. 137 3 mg/( cm~2· s). When concentration of cupric ion was lower than 0. 8 mol/L,the dissolution rate of copper linearly increased with cupric ion and complied with first order dynamical reaction. When the cupric ion concentration was about 1. 0 mol/L,the dissolution rate reached maximum value. The temperature had greatly significance on reaction rate,the reaction rate rapidly increased with temperature,and the dissolution rate reached up to 21. 106 μm·L/( min·mol) at 50℃. The activation energy Eafor dissolution reaction in Arrhenius rule was about 23. 7 k J and the frequency factor A was about 1. 43 × 10~5.
【CateGory Index】: O643.1;TN41
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