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《Chinese Journal of Mechanical Engineering》 2008-11
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Research and Application of LIGA Process at Nationol Synchrotron Radiation Laboratory

LIU Gang TIAN Yangchao (National Synchrotron Radiation Laboratory,University of Science & Technology of China,Hefei 230026)  
LIGA(Lithographie galvanformung and abformug)process is a micro fabrication method that can use various materials to obtain high aspect ratio microstructures.The principle of LIGA techniques and the parameters o f LIGA experimental station at NSRL are introduced.The recent progresses in the research of LIGA techniques at NSRL,such as synchrotron radiation lithography,mi- cro-electroforming,micro-molding,and the application of LIGA techniques,such as micro-inerial devices and micro-fluidic devices, are presented in detail.The development status of research and application of LIGA techniques and the problems encountered are analyzed.Some of the prospects of LIGA application are put forward by combining the features of synchrotron radiation lithgraphy
【Fund】: 国家自然科学基金资助项目(10375058)。
【CateGory Index】: TN40;TP211.4
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【References】
Chinese Journal Full-text Database 4 Hits
1 LI Jin-ying,WANG Xun-zhang,ZHAO Ying-cui,LU Shu-lai,LIU Chang-qing (Research Institute of Jilin Petrochemical Company,Ltd.,PetroChina,Jilin 132021,China);Research and application of micro-chemical technology[J];Science & Technology in Chemical Industry;2011-01
2 ZHU Yongwei WANG Zhanhe FAN Zhongjun TAO Jiansong ZHANG Lei (College of Mechanical Engineering, Yangzhou University, Yangzhou 225009);Ultrosonic Combined Electrical Micro-machining Technology and Its Application[J];Journal of Mechanical Engineering;2010-03
3 LIU Chong1,2 LI Miaomiao1 SHI Weizhi1 DU Liqun1,2 WANG Liding1,2(1.Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology,Dalian 116024; 2.Key Laboratory for Precision & Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology,Dalian 116024);New Method for Dimensional Precision Control of Electroformed Parts by Using Micro Electroforming Technique with SU-8 Thick Photoresist[J];Journal of Mechanical Engineering;2011-03
4 LU Ting-ting,WANG Feng-hui,CHEN Ping-wei(Department of Engineering Mechanics,Northwestern Polytechnical University,Xi'an 710129,China);On the Creep Properties of Nano-particle Reinforced Nickel-matrix Composites of MEMS Microstructures[J];Journal of Experimental Mechanics;2011-02
【Co-citations】
Chinese Journal Full-text Database 8 Hits
1 WEI Yuan-jie~ 1, LIU Chong~ 1* , LI Jing-min ~1, PENG Jia ~2, ZHU Lian-yi ~2 1 Key Laboratory for Micro/Nano Technology and System of Liao Ning Province, Dalian University of Technology, Dalian 116023,China; 2 Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology,Dalian 116023,China;Simulation of Plastic Flow in Microchannel Figuration of Microfluidic Chip Under Hot Embossing[J];Chinese Journal of Sensors and Actuators;2006-05
2 XU Min~1 , LUO Yi~ 1* ,WANG Xiao-dong~1 , LI Nan~2 , LIU Chong~2 1.The Key Laboratory for Dalian University of Technology Precision & Non-traditional Machining of Ministry of Education, Dalian 116023, China; 2.The Key Laboratory for Micro/Nano Technology and System of Liao Ning Province, Dalian 116023, China;Finite Element Analysis of Temperature Effect in Polymer Hot Embossing[J];Chinese Journal of Sensors and Actuators;2006-05
3 HE Yong~(1,2) FU Jianzhong~(1,2) CHEN Zichen~(1,2) (1.College of Mechanical and Energy Engineering,Zhejiang University,Hangzhou 310027;2.Zhejiang Province Key Laboratory of Advanced Manufacturing Technology,Hangzhou 310027);Demolding Defects and the Design of Demolding Device in Micro Hot Embossing Process[J];Chinese Journal of Mechanical Engineering;2008-11
4 LAN Cai-hong,JIANG Bing-yan,LIU Yao,CHEN Wen(Key Lab of Modern Complex Equipment Design and Extreme Manufacturing Ministry of Edu.,College of Electrical & mechanical Eng.,Central South University,Changsha 410083,China);Simulation Study of Microchannel Distortion of Polymeric Microfluidic Chip with Bonding Technique[J];China Plastics Industry;2009-05
5 JIANG Bing-yan,LIU Yao,LI Dai-bing,ZHOU Zhou(Key Lab of Modern Complex Equipment Design and Extreme Manufacturing Ministry of Education,College of electromechanical engineering,Central South University,Changsha 410083,China);Research on Efficient Bonding Procedure of PMMA Microfluidic Chip[J];China Plastics Industry;2010-04
6 HE Yong,FU Jian-zhong,XU Yue-tong,CHEN Zi-chen(Zhejiang Provincial Key Laboratory of Advanced Manufacturing Technology,Zhejiang University,Hangzhou 310027,China);Defects in micro hot embossing process[J];Journal of Zhejiang University(Engineering Science);2009-01
7 TIAN Yang-chao,LIU Gang,HONG Yi-lin,GUO Yu-hua,XIONG Ying,KAN Ya(National Synchrotron Radiation Laboratory,University of Science and Technology of China,Hefei 230029,China);Design of LIGA end-station and its applications[J];Journal of University of Science and Technology of China;2007-Z1
8 XIE Lei 1,ZIEGMANN Gerhard1,JIANG Bing-yan 2(1. Institute of Polymer Materials and Plastics Engineering,Clausthal University of Technology,Agricola Str.6,Clausthal-Zellerfeld 38678,Germany;2. Key Laboratory of Modern Complex Equipment Design and Extreme Manufacturing,Ministry of Education,Central South University,Changsha 410083,China);Numerical simulation method for weld line development in micro injection molding process[J];中南大学学报(英文版);2009-05
China Proceedings of conference Full-text Database 2 Hits
1 Weili Wen , Chuncheng Zuo , Jianqun Yu , and Xuejun Zhang College of Mechanical Science and Engineering, Jilin University, Changchun 130022, China School of Biological and Agricultural Engineering, Jilin University, Changchun 130022,China;Numerical Simulation of Hot Embossing for Polymer Microfluidic Chips[A];[C];2006
2 Guo Yuhua Liu Gang Zhu Xuelin Wang Jun Kan Ya Tian Yangchao National Synchrotron Radiation Laboratory, University of Science and Technology of China,Hefei, 230029;Study on Demolding Process during Hot Embossing[A];[C];2005
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 LI Li1, ZHANG Zhi-guo1, Deng Hai-li2, ZHAO Zheng-ping1,YANG Rui-xia1(1 School of Information Engineering, Hebei University of Technology, Tianjin 300130, China;2.Dep. of Computer, Shijiazhuang Information Engingeering Vocational College,Shijiazhuang 050035, China);Research and Progress of Micromachined Variable Capacitors[J];Semiconductor Technology;2005-05
2 JI Guo-jin,MA Kui ,WANG Lei (China-German Colloge of Tongji University,Shanghai200092,China);Survey on micro-nano positioning /driving technologies[J];Semiconductor Information;2003-05
3 LIU Jing quan,CAI Bing chu,CHEN Di,ZHU Jun, ZHAO Xiao lin,YANG Chun sheng (Research Institute of Micro/Nanometer Science & Technology,Shanghai Jiao tong University,Shanghai 200030,China);SU-8 photoresist and its application in MEMS[J];Micronanoelectronic Technology;2003-Z1
4 Dong Qiaohua,Liao Xiaoping,Huang Qing’an,and Huang Jianqiu(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);Analysis of Pull-In Voltage of RF MEMS Switches[J];Journal of Semiconductors;2008-01
5 YU Huadong (Changchun University of Science and Technology,Changchun 130022);Development of Ultra-precision Micro-machining Technology[J];Journal of Changchun University of Science and Technology(Natural Science Edition);2008-03
6 LIU Guang-hui, KANG Chun-mei (The 49th Research Institute of the Electronics,Ministry of Information Industry,Harbin 150001,China);Developing status and trend of MEMS technology[J];Journal of Transducer Technology;2001-01
7 Xia Mu, Hao Da-bing (Xuzhou Air Force Institute, Xuzhou Jiangsu 221000, China; 2 Nanjing Electronic Devices Inst.,Nanjing Jiangsu 210016, China);Key Technology and Devices of RF MEMS[J];Electronics & Packaging;2006-01
8 HE Zhong wei, ZHOU, Dong lian (East China Photoelectronic IC Research Institute, Bengbu Anhui 233042);Thick film direct writing process[J];ELECTRONIC COMPONENTS $ MATERIALS;1999-05
9 ZHANG Jun-bing, FAN Zi-shuan, SUN Dong-bai, YU Hong-ying, MENG Hui-min, LI Hui-qin (Corrosion and Protection Center, Beijing University of Science and Technology, Beijing Key Laboratory for Corrosion, Erosion and Surface Technology, Beijing 100083, China);Study on Thick-film Nickel Conductive Paste[J];Electronic Components $ Materials;2004-07
10 WANG Yang yuan,WU Guo ying,HAO Yi long,ZHANG Da cheng, XIAO Zhi xiong,LI Ting,ZHANG Guo bing,ZHANG Jin wen(Institute of Microelectronics,Peking University,Beijing 100871,China);Study of Silicon-Based MEMS Technology and Its Standard Process[J];Acta Electronica Sinica;2002-11
【Secondary References】
Chinese Journal Full-text Database 1 Hits
1 DIAO Guo-hu,JIA Lian-jie,ZHU Yong-wei(College of Mechanical Engineering,Yangzhou University,Yangzhou 225117,China);Test Study on Combined Ultrasonic and Electric-discharge for Micro-machining[J];Mechanical Engineering & Automation;2011-04
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