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《Science Technology and Engineering》 2007-16
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Finite Element Analysis of Films with Interfacial Crack

WANG Can,MEN Yu-tao1,LI Lin-an(Mechanics Department of Tianjin University, Tiangin 300072,P.R.China;Mechanical School2 of Tianjin Science and Technolgy University1, Tianjin 300000,P.R.China)  
Film-substrate materials are used widely in many project fields, but in the process of manufacture and use, cracks always easily formed in the interface of film-substrate. Crack propagation leading to decohesion or delamination is one of the major failure. Now the cohesion of between film and substrate material is measured by scratching experiment. According to scratching experiment and research findings, a mechanical model applied to mechanics response is established firstly, which imitates to the beginning process of scratching test. Then the numerical programs are developed on the platform FEPG (Finite Element Program Generating System) software. The influence of crack position on TiN/Au/HSS film and TiN film with different substrate and the length of crack on TiN/HSS single film are analyzed, and the result shows that stresses of film are influenced with cracks.
【CateGory Index】: TB383.2
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