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《Science Technology and Engineering》 2012-27
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Temperature Measurement Analysis of Circuit Boards Based on Infrared Thermography

GONG Ming-wen,LI Yun-xia,MENG Wen,WEI Xin,LI Da(Telecommunication Engineering Institute,AFEU,Xi’an 710077,P.R.China)  
The board infrared temperature measurement is an important aspect of the infrared thermography applications,but it has failed to get in-depth applications due to the complexity of the influencing factors in the temperature measurement process.The theoretical derivation of the influencing factors of the infrared temperature measurement of the circuit board is given,indicated that the environmental temperature and radiation rate is the main factor affecting the temperature measurement accuracy in the general board of infrared temperature measurement,and analyed the two factors specifically.The results of the analysis using experimental data are verifed.The experimental data are fitted to visually demonstrate the impact of environmental temperature and radiation rate through matlab.The basis for the calibration of infrared temperature measurement of the circuit board is provided.
【CateGory Index】: TN214;TN405
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【Citations】
Chinese Journal Full-text Database 7 Hits
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