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《Journal of Xiamen University of Technology》 2017-06
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A Six Sigma Approach for PCB Lithography Process Improvement

JIANG Qingquan;LIN Yucheng;CHEN Qinglan;LIU Hao;School of Economics & Management,Xiamen University of Technology;  
A six-sigma quality improvement plan of DMAIC steps was developed to lower the high defect rate of lithography process,targeting on the continuous improvement of lithography process of a printed circuit board company. Five key factors were selected,and,using full factor experiment for optimal parameters combination,the best parameters for the standardized pressure film machine corresponding to these factors were determined:pressure membrane speed at 2. 0 m/min, squeeze film pressure at 0. 4 MPa, squeeze film temperature at120 ℃,preheating temperature at 100 ℃,and postheating temperature at 110 ℃. The results show a decrease in the gap defect rate from 3. 8% to 2. 53%,and indicate that the approach beneficial to lower the high defect rate of lithography process.
【Fund】: 福建省社会科学规划项目(FJ2016B109);; 厦门理工学院高层次人才项目(YSK15013R);; 福建省中青年教师教育科研项目(JAS160390)
【CateGory Index】: TN41
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