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Electronic Speckle-Shearing Patten Interferometry for Vibration Analysis

JING Chao,JING Wen-cai,XU Tian-hua,LIU Na,ZHOU Ge,ZHANG Yi-mo (Key Laboratory of Opto-Electronics Information and Technical Science,Ministry of Education,School of Precision Instrument & Opto-Electronics Engineering,Tianjin University, Tianjin 300072, China)  
Electronic speckle-shearing patten interferometry (ESSPI) has been applied for non destructive tes-ting(NDT) , strain analysis,vibration analysis and flow field analysis as a kind of high - precision full - field measurement. ESSPI is applied for vibration analysis in this paper. The theory of time - average method is analyzed in this paper,and the optical structure of ESSPI is designed for achieving vibration analysis of large area. The rectangle area of 669 mm ×502 mm is once measured by ESSPI. Random height function of surfaces of Gauss correlation and images of speckle - shearing Patten stripes engendered by vibration are simulated by computer. It is proved that ESSPI can be applied for vibration analysis.
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