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《Journal of Synthetic Crystals》 2015-01
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Investigation on Chemical Mechanical Polish of Glass Ceramics Substrate of Hard Disk

WANG Jin-pu;BAI Lin-shan;CHU Xiang-feng;School of Chemistry and Chemical Engineering,Anhui University of Technology;  
In this work,chemical mechanical polish experiments were done on glass ceramics substrates using self-made polishing liquid. The effects of polishing pressure,concentration of SiO2,pH of slurry and concentration of oxidant((NH4)2S2O8) on the material removal rate and the surface roughness of the glass ceramics substrate were investigated. The polishing process conditions were optimized by analyzing the influence factors of the glass ceramics CMP technique systematically,then the surface roughness of glass ceramics substrate after polishing was measured by an Atomic Force Microscopy(AFM). The results show that under the following CMP conditions: 9. 4 k Pa,8wt% SiO2,pH = 8 and2wt%(NH4)2S2O8,the MRR and the Ra could attain 86. 2 nm/min and 0. 1 nm,respectively.
【Fund】: 国家自然科学基金(50975002);; 教育部高校留学回国人员科研项目;; 安徽省教育厅自然科学基金(KJ2011A057)
【CateGory Index】: TN305.2
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