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《Precise Manufacturing & Automation》 2006-03
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Micro-Manufacturing Technology and Independence Innovation

It's known that great attention has been paid to traditional heavy manufacturing industry, but few research and discussion are made systemically to micro-manufacturing industry in China, microsystem and micro-manufacturing products are dramatically change in many industrial fields for the 21st century. This text describes the development history, domestic and abroad status and strategic ideas of micro-manufacturing, basing on setting forth the concept of micro-manufacturing. Summarizing the experience and lesson of traditional heavy manufacturing, independence innovation is still the key point of developing micro-manufacturing industry, in addition to learning from developed countries, importing advanced technology, and enhancing international cooperation.
【CateGory Index】: TH16
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Chinese Journal Full-text Database 1 Hits
1 ;Research on International Advanced Manufacture Technology Frontier Domains Based on Konowledge Mapping[J];Science & Technology Progress and Policy;2008-06
Chinese Journal Full-text Database 5 Hits
1 Zhong Xianxin (Microsystems R & D center of Chongqing University,Chongqing 400044,China)[;Prospects of Microsystems Research and Development[J];ENGINEERING SCIENCE;2000-01
2 Wang Xiankui (Tsinghua University);HISTORY REVIEW AND CHANCE AND CHALLENGE FOR MANUFACTURING TECHNOLOGY[J];Chinese Journal of Mechanical Engineering;2002-08
3 ;21世纪制造技术发展趋势及重点发展方向[J];Machinery;2003-03
4 ;Micro-machining Technique Developing Status, Tendency and Its Key Technology[J];Grinder and Grinding;2002-02
5 ZHANG Weiyi (Nanjing University of Science and Technology, Nanjing,China)HOU Liya;Meaning and Commercialization of Microsystems[J];CHINA MECHANICAL ENGINEERING;2000-03
Chinese Journal Full-text Database 10 Hits
1 HU Chun-feng(School of Humanities and Law,Tongji University,Shanghai,200092);Moral Self-discipline and Legal Discipline in the Study and Application of Biological Technology[J];;2006-05
2 WANG Li-tao,HE Hui-juan,GONG Jian-cheng(Dept. of Mech . Engn., Anhui University of Technology and Science,Wuhu 241000,China);Promoting strategy of mechanical speciality in our university on the basis of the manufacturing industry process in the 21st Century[J];Journal of Anhui University of Technology and Science;2004-01
3 LIU Chunxiao1,JIN Xiaofeng2 (1. Institute of Distance Education,Jiaozuo University,Jiaozuo 454003,China; 2. Electrical and Mechanical College,Jiaozuo University,Jiaozuo 454003,China);Research into the Geometric Modeling and Simulation of the NC Machining[J];Journal of Anyang Institute of Technology;2009-06
4 XIA Fafeng,JIAO Jinlong,DING Junjie,MIAO Liang(College of Mechanical Science and Engineering,Northeast Petroleum University,Daqing 163318,China);Effect of ultrasonic-electrodepositon parameters on the morphology of Ni-SiC micro-castings[J];Ordnance Material Science and Engineering;2012-03
5 WANG Zhen-yua, CHENG Lib, ZHU Junb (a. Institute of Applied Science and Technology, b. Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Manufacturing Technologies for MEMS at Micro/Nanometer Level[J];Semiconductor Technology;2005-08
6 NIE Lei1,SHI Tie-lin1,LIAO Guang-lan1,ZHONG Fei2(1.Institute of MicrosystemsH,uazhong University of Science and Technology,Wuhan 430074,China;2.Hubei Polytechnic University,Wuhan 430068,China);Application of Cr Mask in Si Wet Etching[J];Semiconductor Technology;2005-12
7 LIU Da zhen 1, YAN Wei ping 1, GUO Ji hong 2, DU Li qun 2 (1.Dept of Electronic Engineering;2.Research Center for Microsystem Technology, Dalian University of Technology, Dalian 116023,China);Fabrication and thermal analysis of microchamber in PCR biochip[J];Micronanoelectronic Technology;2003-Z1
8 MING Ping-mei1,HU Yang-yang1,ZHU Jian2 (1.Nanjing University of Aeronautics & Astronautics,Nanjing 210016,China; 2.Nanjing Electronic Devices Institute,Nanjing 210016,China);Analysis on Technique Keys for Fabricating MEMS Devices in Micro EDM[J];Micronanoelectronic Technology;2005-04
9 JIANG Zheng,DING Gui-fu,ZHANG Dong-mei(Micro/Nano Sci&Tec Research Institute of Shanghai Jiaotong University,Shanghai 200030,China);Structure Design of a Quick Respond Bistable Thermal Actuator[J];Micronanoelectronic Technology;2005-10
10 Zhang Zhaoyang1,2,Mao Weiping1,Chen Fei1(1.School of Mechanical Engineering,Jiangsu University,Zhenjiang 212013,China;2.College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China);Nanometer and Submicron Electrochemical Micromachining Using Ultra-Short Voltage Pulses[J];Micronanoelectronic Technology;2009-11
China Proceedings of conference Full-text Database 4 Hits
1 LIU Qian DU Qing-zhi YANG Qiu-ping (Kunming University of Science and Technology, Kunming, 650093, China);The application of information technology in equipment manufacturing industry[A];[C];2010
2 Jiang Qinghua Yuan Weizheng Chang Honglong Wang Tao Northwestern Polytechnical University,Xi'an,710072;Study on Signal Detection Techniques for the Capacitive Micromachined Inertial Sensors[A];[C];2005
3 ZHAN Wei, YING Yi-rong (Finance Department,School of International Business and Management, Shanghai University,Shanghai 201800, China);The Strategic Problem of Manufacturing Development Based on Cycling Economy[A];[C];2006
4 ;The Green Study on Manufacturing Industry Under Harmonious Angle:Based on the 31 Provinces and Cities of Comparative Analysis[A];[C];2008
Chinese Journal Full-text Database 10 Hits
1 LI Li1, ZHANG Zhi-guo1, Deng Hai-li2, ZHAO Zheng-ping1,YANG Rui-xia1(1 School of Information Engineering, Hebei University of Technology, Tianjin 300130, China;2.Dep. of Computer, Shijiazhuang Information Engingeering Vocational College,Shijiazhuang 050035, China);Research and Progress of Micromachined Variable Capacitors[J];Semiconductor Technology;2005-05
2 JI Guo-jin,MA Kui ,WANG Lei (China-German Colloge of Tongji University,Shanghai200092,China);Survey on micro-nano positioning /driving technologies[J];Semiconductor Information;2003-05
3 Dong Qiaohua,Liao Xiaoping,Huang Qing’an,and Huang Jianqiu(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);Analysis of Pull-In Voltage of RF MEMS Switches[J];Journal of Semiconductors;2008-01
4 Liu Qiang Li Zhehao Tang Xiaoqing (School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China);Development of manufacturing science and engineering and its up-to-date research directions[J];Journal of Beijing University of Aeronautics and Astronautics;2004-04
5 YU Huadong (Changchun University of Science and Technology,Changchun 130022);Development of Ultra-precision Micro-machining Technology[J];Journal of Changchun University of Science and Technology(Natural Science Edition);2008-03
6 LIU Guang-hui, KANG Chun-mei (The 49th Research Institute of the Electronics,Ministry of Information Industry,Harbin 150001,China);Developing status and trend of MEMS technology[J];Journal of Transducer Technology;2001-01
7 Xia Mu, Hao Da-bing (Xuzhou Air Force Institute, Xuzhou Jiangsu 221000, China; 2 Nanjing Electronic Devices Inst.,Nanjing Jiangsu 210016, China);Key Technology and Devices of RF MEMS[J];Electronics & Packaging;2006-01
8 HE Zhong wei, ZHOU, Dong lian (East China Photoelectronic IC Research Institute, Bengbu Anhui 233042);Thick film direct writing process[J];ELECTRONIC COMPONENTS $ MATERIALS;1999-05
9 ZHANG Jun-bing, FAN Zi-shuan, SUN Dong-bai, YU Hong-ying, MENG Hui-min, LI Hui-qin (Corrosion and Protection Center, Beijing University of Science and Technology, Beijing Key Laboratory for Corrosion, Erosion and Surface Technology, Beijing 100083, China);Study on Thick-film Nickel Conductive Paste[J];Electronic Components $ Materials;2004-07
10 WEN Xiao-yun,SHI Yu-jie,NIU Zhong-xia(Information and Engineering University of PLA,Zhengzhou 450002,China);Overview of system reliability model[J];Electronic Product Reliability and Environmental Testing;2005-03
【Secondary References】
Chinese Journal Full-text Database 6 Hits
1 ZHU Zi-qiang1,2,CHEN Jin2,QIAO Zhi-qiang2,HUANG Bing2,YANG Guang-cheng2,NIE Fu-de2(1.Southwest University of Science and Technology,Mianyang 621010,China;2.Institute of Chemical Materials,CAEP,Mianyang 621900,China);Preparation and Characterization of Direct Write Explosive Ink Based on CL-20[J];Chinese Journal of Energetic Materials;2013-02
2 HUANG Jianhua;ZHU Caiping;Changzhou Xingyu Automotive Lighting System Co.,Ltd.;;Defect Analysis of LDS Process for the 3D-circuit Board of Lamp[J];Automobile Parts;2014-12
3 ZHANG Bao-sheng1,2 (1. Liaoning University,Shenyang 100036; 2. Shangqiu Normal College,Shangqiu 476000);Analysis on Competition Model of Advanced Manufacturing Base Based on Dynamic Embeddedness[J];Journal of Yanshan University(Philosophy and Social Science Edition);2009-03
4 CAO Yu1,LIU Jian-guo2,ZENG Xiao-yan2(1.College of Mechanical and Electrical Engineering,Wenzhou University,Wenzhou 325000,China;2.College of Optoelectronics Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China);Fabrication of multi-electrode array system by micropen-laser hybrid direct writing technology[J];Journal of Zhejiang University(Engineering Science);2012-06
5 LIU Ya(Institute of Scientific & Technical Information of China,Beijing 100038,China);Mapping China's International Collaboration in Environmental Research through International Co-authorship Data[J];China Soft Science;2011-06
6 HUANG Jianhua;ZHU Caiping;XU Lina;Changzhou Xingyu Automotive Lighting System Co., Ltd.;;3D-MID Used for Automotive Lamps Based on LDS Process[J];China Light & Lighting;2015-01
【Secondary Citations】
Chinese Journal Full-text Database 10 Hits
1 Yan Yongnian Cui Fuzhai Zhang Renji Hu YunyuTsing Hua University, Beijing, China Fourth Military Medical University, Xi'an, China;Rapid Prototyping Manufacturing for Artificial Human Bone[J];Materials Review;2000-02
2 ZHONG Xian Xin,LI Jian Shu,XIAO Sha Li,XU Tao,ZHU Wei An (The Microsystems Research Center of Chongqing University,Chongqing 630044) MIAO Xiu E (The Mechatronic Engineering Departement,South China University of Technology,Guangzhou 510641);Progress in Microsystems Integrated Technology[J];OPTICS AND PRECISION ENGINEERING;1998-04
4 <author>Qian Bibo;The Nano Technology And Its Applications in Micro Machinery[J];Machinery;1997-11
5 Zhang Ke;Manufacturing Technologies for MEMS and Their Applications[J];Machinery;1999-08
6 Zhong,Xian-xin(Chongqing University);Present and Prospective Trends in Nano Technology[J];Chinese Journal of Scientific Instrument;1995-S1
7 Wang Liding(Dalian University of Technology, Dalian,China )Wu Yihui;Seize the Opportunity and Push MEMS Forward in Our Country Rapidly[J];CHINA MECHANICAL ENGINEERING;1999-02
8 Wen Shizhu et al.(Tsinghua University, Beijing,China);Research on Micro-Machine and Nano- Mechanics[J];CHINA MECHANICAL ENGINEERING;1996-02
9 DONG Shen(Harbin University of Industry);New Opportunities Brought by Nanometer Technology to the Manufacturing Industry of China[J];Manufacturing Technology & Machine Tool;2001-08
10 Yu Ying;A Practical Ultramicro technology-LIGA Technology and Its Application[J];Manufacturing Technology & Machine Tool;1994-03
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